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SMIC Revenue Jumps 20% as China Narrows the Foundry Gap With Samsung
Semiconductor, Industry Angel Morales 9/10/26 Semiconductor, Industry Angel Morales 9/10/26

SMIC Revenue Jumps 20% as China Narrows the Foundry Gap With Samsung

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Samsung and SK hynix Memory Inventories Reportedly Fall Below 10 Days as AI Demand Tightens Supply
Semiconductor, Industry Angel Morales 9/10/26 Semiconductor, Industry Angel Morales 9/10/26

Samsung and SK hynix Memory Inventories Reportedly Fall Below 10 Days as AI Demand Tightens Supply

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CXMT HBM3 Yield Stalls Near 25% as TSV and Stacking Issues Cut Final Output
Semiconductor, Industry Angel Morales 9/10/26 Semiconductor, Industry Angel Morales 9/10/26

CXMT HBM3 Yield Stalls Near 25% as TSV and Stacking Issues Cut Final Output

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Intel Processes 1 Million High NA EUV Wafers as Early Adoption Pulls Ahead of TSMC and Samsung
Semiconductor Angel Morales 9/9/26 Semiconductor Angel Morales 9/9/26

Intel Processes 1 Million High NA EUV Wafers as Early Adoption Pulls Ahead of TSMC and Samsung

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NVIDIA RTX 5070 Could Gain Larger GB203 Die Without a Performance Upgrade
Semiconductor, Hardware Angel Morales 9/9/26 Semiconductor, Hardware Angel Morales 9/9/26

NVIDIA RTX 5070 Could Gain Larger GB203 Die Without a Performance Upgrade

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Intel CPU Prices Could Rise Another 10% in October as Profitability Takes Priority
Semiconductor, Hardware Angel Morales 9/9/26 Semiconductor, Hardware Angel Morales 9/9/26

Intel CPU Prices Could Rise Another 10% in October as Profitability Takes Priority

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CXMT and YMTC Reportedly Stockpile Enough ASML DUV Systems for 3 Years of Expansion
Semiconductor, Business Angel Morales 9/9/26 Semiconductor, Business Angel Morales 9/9/26

CXMT and YMTC Reportedly Stockpile Enough ASML DUV Systems for 3 Years of Expansion

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Samsung 4 nm Lines Reach Full Utilization as HBM4 Takes Up to 60% of Capacity
Semiconductor, Hardware Angel Morales 9/8/26 Semiconductor, Hardware Angel Morales 9/8/26

Samsung 4 nm Lines Reach Full Utilization as HBM4 Takes Up to 60% of Capacity

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NAURA Demonstrates 64 Layer 3D DRAM Etch Process as China Pushes Beyond EUV Limits
Semiconductor Angel Morales 9/7/26 Semiconductor Angel Morales 9/7/26

NAURA Demonstrates 64 Layer 3D DRAM Etch Process as China Pushes Beyond EUV Limits

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ZEISS Says China May Be 15 Years Behind EUV as Sanctions Risk Accelerating Its Catch Up
Semiconductor, Industry Angel Morales 9/5/26 Semiconductor, Industry Angel Morales 9/5/26

ZEISS Says China May Be 15 Years Behind EUV as Sanctions Risk Accelerating Its Catch Up

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UBS Says China Remains Around 10 Years Behind ASML in EUV Lithography
Semiconductor, Industry Angel Morales 9/3/26 Semiconductor, Industry Angel Morales 9/3/26

UBS Says China Remains Around 10 Years Behind ASML in EUV Lithography

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Intel Says 14A Defect Reduction Is Fastest Since 22 nm as Foundry Push Intensifies
Semiconductor, Hardware Angel Morales 9/2/26 Semiconductor, Hardware Angel Morales 9/2/26

Intel Says 14A Defect Reduction Is Fastest Since 22 nm as Foundry Push Intensifies

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Anthropic Launches Claude Fable 5.1 as Samsung Expands Claude Code Into Chip Design
AI, Hardware, Semiconductor Angel Morales 9/2/26 AI, Hardware, Semiconductor Angel Morales 9/2/26

Anthropic Launches Claude Fable 5.1 as Samsung Expands Claude Code Into Chip Design

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AMD Says Hybrid Bonded 3D DRAM Could Be 17x More Energy Efficient Than HBM
Semiconductor, Hardware Angel Morales 9/2/26 Semiconductor, Hardware Angel Morales 9/2/26

AMD Says Hybrid Bonded 3D DRAM Could Be 17x More Energy Efficient Than HBM

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Micron Taiwan Workers Move Closer to Strike as 80% Back Action Over Bonuses
Semiconductor, Business Angel Morales 9/2/26 Semiconductor, Business Angel Morales 9/2/26

Micron Taiwan Workers Move Closer to Strike as 80% Back Action Over Bonuses

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NVIDIA NVHBM Could Reshape HBM Economics as Base Die Costs Rise
AI, Semiconductor, Hardware Angel Morales 9/1/26 AI, Semiconductor, Hardware Angel Morales 9/1/26

NVIDIA NVHBM Could Reshape HBM Economics as Base Die Costs Rise

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TSMC Q2 Employee Bonuses Surge More Than 50% as AI Talent Competition Intensifies
Semiconductor, Industry Angel Morales 8/31/26 Semiconductor, Industry Angel Morales 8/31/26

TSMC Q2 Employee Bonuses Surge More Than 50% as AI Talent Competition Intensifies

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Korean DRAM Export Value Jumps 401% as AI Memory Shortage Pushes Prices to Extreme Levels
Semiconductor, Hardware Angel Morales 8/31/26 Semiconductor, Hardware Angel Morales 8/31/26

Korean DRAM Export Value Jumps 401% as AI Memory Shortage Pushes Prices to Extreme Levels

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CXMT Pushes Hafnium Based DRAM Technology as 1a Node Ambitions Accelerate
Hardware, Semiconductor Angel Morales 8/28/26 Hardware, Semiconductor Angel Morales 8/28/26

CXMT Pushes Hafnium Based DRAM Technology as 1a Node Ambitions Accelerate

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Fujitsu MONAKA Stacks 2 nm CPU Cores Over 5 nm SRAM as MONAKA X Targets 1.4 nm in 2029
AI, Semiconductor, Hardware Angel Morales 8/27/26 AI, Semiconductor, Hardware Angel Morales 8/27/26

Fujitsu MONAKA Stacks 2 nm CPU Cores Over 5 nm SRAM as MONAKA X Targets 1.4 nm in 2029

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