Semiconductor, Hardware Angel Morales 10/4/26 Semiconductor, Hardware Angel Morales 10/4/26 Tesla Cuts AI5 and AI6 Memory Targets as Optimus Production Pushes Into Supply Reality Read More Semiconductor, Business Angel Morales 10/4/26 Semiconductor, Business Angel Morales 10/4/26 Micron Says Physical AI Could Keep Memory Demand Tight Through 2028 Read More Semiconductor, Industry Angel Morales 10/1/26 Semiconductor, Industry Angel Morales 10/1/26 Samsung Foundry Losses Could Narrow as HBM4 Drives 4 nm Demand Read More Semiconductor Angel Morales 9/30/26 Semiconductor Angel Morales 9/30/26 Montage Technology Begins Mass Production of DDR5 9200 MT/s CKD and 8000 MT/s Server RCD Read More AI, Semiconductor, Rumor Angel Morales 9/29/26 AI, Semiconductor, Rumor Angel Morales 9/29/26 TSMC A14 Trial Production Reportedly Starts in 2027 as 2028 Volume Ramp Remains on Track Read More AI, Semiconductor Angel Morales 9/24/26 AI, Semiconductor Angel Morales 9/24/26 12 Inch Polished Wafer Prices Could Rise Over 40% in 2027 as AI Tightens Supply Read More AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More Semiconductor, Industry Angel Morales 9/23/26 Semiconductor, Industry Angel Morales 9/23/26 CXMT Moves Into NAND as YMTC Prepares DRAM, Setting Up a Chinese Memory Rivalry Read More Semiconductor Angel Morales 9/23/26 Semiconductor Angel Morales 9/23/26 Micron Ends 2 GB GDDR7 Production as Graphics Memory Shifts Toward Higher Capacities Read More AI, Semiconductor, Industry Angel Morales 9/23/26 AI, Semiconductor, Industry Angel Morales 9/23/26 TSMC A14 Trial Production Could Begin in Q1 2027 as 3 nm Capacity Surges Read More Semiconductor, Industry Angel Morales 9/22/26 Semiconductor, Industry Angel Morales 9/22/26 Intel Reportedly Turns to AUO for Micro LED CPO and Advanced Glass Packaging Read More Semiconductor, Hardware, Rumor Angel Morales 9/22/26 Semiconductor, Hardware, Rumor Angel Morales 9/22/26 4 GB and 6 GB GDDR7 Chips Could Arrive in 2027 or 2028 Read More Semiconductor Angel Morales 9/22/26 Semiconductor Angel Morales 9/22/26 Samsung HBM4 Output Could at Least Double in 2027 as AI Demand Accelerates Read More AI, Semiconductor, Industry Angel Morales 9/21/26 AI, Semiconductor, Industry Angel Morales 9/21/26 TSMC Longtan Expansion Moves Forward With 1.4 nm and Future Angstrom Class Fabs Planned Read More AI, Hardware, Semiconductor Angel Morales 9/18/26 AI, Hardware, Semiconductor Angel Morales 9/18/26 Huawei Accelerates Ascend AI Roadmap With 960 Chips and 4,096 NPU Atlas SuperPoD Read More Semiconductor, Industry Angel Morales 9/18/26 Semiconductor, Industry Angel Morales 9/18/26 China Develops DUV GAA Transistors, but Full Process Still Faces 5 nm Class Density Limits Read More Hardware, Semiconductor, Announcement Angel Morales 9/16/26 Hardware, Semiconductor, Announcement Angel Morales 9/16/26 Micron Packs 512 GB Into a Single DDR5 RDIMM at Up to 9200 MT/s Read More Semiconductor Angel Morales 9/16/26 Semiconductor Angel Morales 9/16/26 TSMC 2 nm Capacity Could Reach 110,000 Wafers per Month by Mid 2027 Read More AI, Semiconductor, Business Angel Morales 9/14/26 AI, Semiconductor, Business Angel Morales 9/14/26 TSMC Could Double CoWoS Capacity by 2028 as AI Packaging Demand Spills to Rivals Read More Semiconductor, Industry Angel Morales 9/11/26 Semiconductor, Industry Angel Morales 9/11/26 TSMC’s 1.4 nm A14 Could Enter Mass Production in 2H 2027, Ahead of Official 2028 Roadmap Read More Older Posts
Semiconductor, Hardware Angel Morales 10/4/26 Semiconductor, Hardware Angel Morales 10/4/26 Tesla Cuts AI5 and AI6 Memory Targets as Optimus Production Pushes Into Supply Reality Read More
Semiconductor, Business Angel Morales 10/4/26 Semiconductor, Business Angel Morales 10/4/26 Micron Says Physical AI Could Keep Memory Demand Tight Through 2028 Read More
Semiconductor, Industry Angel Morales 10/1/26 Semiconductor, Industry Angel Morales 10/1/26 Samsung Foundry Losses Could Narrow as HBM4 Drives 4 nm Demand Read More
Semiconductor Angel Morales 9/30/26 Semiconductor Angel Morales 9/30/26 Montage Technology Begins Mass Production of DDR5 9200 MT/s CKD and 8000 MT/s Server RCD Read More
AI, Semiconductor, Rumor Angel Morales 9/29/26 AI, Semiconductor, Rumor Angel Morales 9/29/26 TSMC A14 Trial Production Reportedly Starts in 2027 as 2028 Volume Ramp Remains on Track Read More
AI, Semiconductor Angel Morales 9/24/26 AI, Semiconductor Angel Morales 9/24/26 12 Inch Polished Wafer Prices Could Rise Over 40% in 2027 as AI Tightens Supply Read More
AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More
Semiconductor, Industry Angel Morales 9/23/26 Semiconductor, Industry Angel Morales 9/23/26 CXMT Moves Into NAND as YMTC Prepares DRAM, Setting Up a Chinese Memory Rivalry Read More
Semiconductor Angel Morales 9/23/26 Semiconductor Angel Morales 9/23/26 Micron Ends 2 GB GDDR7 Production as Graphics Memory Shifts Toward Higher Capacities Read More
AI, Semiconductor, Industry Angel Morales 9/23/26 AI, Semiconductor, Industry Angel Morales 9/23/26 TSMC A14 Trial Production Could Begin in Q1 2027 as 3 nm Capacity Surges Read More
Semiconductor, Industry Angel Morales 9/22/26 Semiconductor, Industry Angel Morales 9/22/26 Intel Reportedly Turns to AUO for Micro LED CPO and Advanced Glass Packaging Read More
Semiconductor, Hardware, Rumor Angel Morales 9/22/26 Semiconductor, Hardware, Rumor Angel Morales 9/22/26 4 GB and 6 GB GDDR7 Chips Could Arrive in 2027 or 2028 Read More
Semiconductor Angel Morales 9/22/26 Semiconductor Angel Morales 9/22/26 Samsung HBM4 Output Could at Least Double in 2027 as AI Demand Accelerates Read More
AI, Semiconductor, Industry Angel Morales 9/21/26 AI, Semiconductor, Industry Angel Morales 9/21/26 TSMC Longtan Expansion Moves Forward With 1.4 nm and Future Angstrom Class Fabs Planned Read More
AI, Hardware, Semiconductor Angel Morales 9/18/26 AI, Hardware, Semiconductor Angel Morales 9/18/26 Huawei Accelerates Ascend AI Roadmap With 960 Chips and 4,096 NPU Atlas SuperPoD Read More
Semiconductor, Industry Angel Morales 9/18/26 Semiconductor, Industry Angel Morales 9/18/26 China Develops DUV GAA Transistors, but Full Process Still Faces 5 nm Class Density Limits Read More
Hardware, Semiconductor, Announcement Angel Morales 9/16/26 Hardware, Semiconductor, Announcement Angel Morales 9/16/26 Micron Packs 512 GB Into a Single DDR5 RDIMM at Up to 9200 MT/s Read More
Semiconductor Angel Morales 9/16/26 Semiconductor Angel Morales 9/16/26 TSMC 2 nm Capacity Could Reach 110,000 Wafers per Month by Mid 2027 Read More
AI, Semiconductor, Business Angel Morales 9/14/26 AI, Semiconductor, Business Angel Morales 9/14/26 TSMC Could Double CoWoS Capacity by 2028 as AI Packaging Demand Spills to Rivals Read More
Semiconductor, Industry Angel Morales 9/11/26 Semiconductor, Industry Angel Morales 9/11/26 TSMC’s 1.4 nm A14 Could Enter Mass Production in 2H 2027, Ahead of Official 2028 Roadmap Read More
