Semiconductor, Hardware Angel Morales 3/20/26 Semiconductor, Hardware Angel Morales 3/20/26 AMD Secures Samsung HBM4 for Instinct MI455X, but the Real Surprise Is the Foundry Angle Read More Semiconductor, AI, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, AI, Hardware, GTC 2026 Angel Morales 3/17/26 Samsung Unveils HBM4E With Up to 4 TB/s Bandwidth Per Stack, While HBM4 Enters Mass Production for NVIDIA Vera Rubin Read More Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Micron Starts High Volume Production of HBM4, PCIe Gen6 SSDs and SOCAMM2 for NVIDIA Vera Rubin Read More AI, Hardware, GTC 2026 Angel Morales 3/17/26 AI, Hardware, GTC 2026 Angel Morales 3/17/26 NVIDIA Vera Rubin Unveils a New AI Data Center Blueprint With 288 GB HBM4, 22 TB/s Bandwidth and 50 PFLOPs Per GPU Read More Semiconductor Angel Morales 2/14/26 Semiconductor Angel Morales 2/14/26 Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom Read More Semiconductor, Hardware Angel Morales 2/13/26 Semiconductor, Hardware Angel Morales 2/13/26 Samsung Begins Mass Production and Shipments of HBM4 Read More Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More AI, Hardware, Business Angel Morales 2/10/26 AI, Hardware, Business Angel Morales 2/10/26 Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply Read More Hardware, Semiconductor Angel Morales 1/27/26 Hardware, Semiconductor Angel Morales 1/27/26 Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June Read More AI, Hardware Angel Morales 1/23/26 AI, Hardware Angel Morales 1/23/26 NVIDIA Rushes Vera Rubin Bandwidth Upgrades as AMD Instinct MI455X Turns Up Competitive Pressure Read More Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More Hardware, CES 2026, Announcement Angel Morales 1/7/26 Hardware, CES 2026, Announcement Angel Morales 1/7/26 AMD Steps Into 2nm With EPYC Venice Zen 6 And Instinct MI455X, Targeting Helios AI Rack With Liquid Cooling, HBM4, And Multi Exaflop Scale Read More AI, Hardware, CES 2026 Angel Morales 1/6/26 AI, Hardware, CES 2026 Angel Morales 1/6/26 NVIDIA Says Rubin Is In Full Production In Q1 2026 After 3 Years Of Development Read More AI, Hardware, Announcement, CES 2026 Angel Morales 1/6/26 AI, Hardware, Announcement, CES 2026 Angel Morales 1/6/26 NVIDIA To Dominate The AI Markets With Its Rubin Platform Read More Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More Semiconductor Angel Morales 12/22/25 Semiconductor Angel Morales 12/22/25 Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements Read More Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More Hardware Angel Morales 11/20/25 Hardware Angel Morales 11/20/25 AMD Instinct MI430X AI Chip Introduced With HBM4 Memory and Massive Bandwidth Read More AI, Hardware Angel Morales 10/31/25 AI, Hardware Angel Morales 10/31/25 Samsung to Deploy 50,000 NVIDIA GPUs in New AI Megafactory to Revolutionize Chip Manufacturing Read More Semiconductor Angel Morales 10/23/25 Semiconductor Angel Morales 10/23/25 Samsung’s HBM4 Modules Reportedly Achieve 90% Logic Yield, Signaling Imminent Mass Production Read More Older Posts
Semiconductor, Hardware Angel Morales 3/20/26 Semiconductor, Hardware Angel Morales 3/20/26 AMD Secures Samsung HBM4 for Instinct MI455X, but the Real Surprise Is the Foundry Angle Read More
Semiconductor, AI, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, AI, Hardware, GTC 2026 Angel Morales 3/17/26 Samsung Unveils HBM4E With Up to 4 TB/s Bandwidth Per Stack, While HBM4 Enters Mass Production for NVIDIA Vera Rubin Read More
Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Micron Starts High Volume Production of HBM4, PCIe Gen6 SSDs and SOCAMM2 for NVIDIA Vera Rubin Read More
AI, Hardware, GTC 2026 Angel Morales 3/17/26 AI, Hardware, GTC 2026 Angel Morales 3/17/26 NVIDIA Vera Rubin Unveils a New AI Data Center Blueprint With 288 GB HBM4, 22 TB/s Bandwidth and 50 PFLOPs Per GPU Read More
Semiconductor Angel Morales 2/14/26 Semiconductor Angel Morales 2/14/26 Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom Read More
Semiconductor, Hardware Angel Morales 2/13/26 Semiconductor, Hardware Angel Morales 2/13/26 Samsung Begins Mass Production and Shipments of HBM4 Read More
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More
AI, Hardware, Business Angel Morales 2/10/26 AI, Hardware, Business Angel Morales 2/10/26 Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply Read More
Hardware, Semiconductor Angel Morales 1/27/26 Hardware, Semiconductor Angel Morales 1/27/26 Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June Read More
AI, Hardware Angel Morales 1/23/26 AI, Hardware Angel Morales 1/23/26 NVIDIA Rushes Vera Rubin Bandwidth Upgrades as AMD Instinct MI455X Turns Up Competitive Pressure Read More
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
Hardware, CES 2026, Announcement Angel Morales 1/7/26 Hardware, CES 2026, Announcement Angel Morales 1/7/26 AMD Steps Into 2nm With EPYC Venice Zen 6 And Instinct MI455X, Targeting Helios AI Rack With Liquid Cooling, HBM4, And Multi Exaflop Scale Read More
AI, Hardware, CES 2026 Angel Morales 1/6/26 AI, Hardware, CES 2026 Angel Morales 1/6/26 NVIDIA Says Rubin Is In Full Production In Q1 2026 After 3 Years Of Development Read More
AI, Hardware, Announcement, CES 2026 Angel Morales 1/6/26 AI, Hardware, Announcement, CES 2026 Angel Morales 1/6/26 NVIDIA To Dominate The AI Markets With Its Rubin Platform Read More
Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More
Semiconductor Angel Morales 12/22/25 Semiconductor Angel Morales 12/22/25 Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements Read More
Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More
Hardware Angel Morales 11/20/25 Hardware Angel Morales 11/20/25 AMD Instinct MI430X AI Chip Introduced With HBM4 Memory and Massive Bandwidth Read More
AI, Hardware Angel Morales 10/31/25 AI, Hardware Angel Morales 10/31/25 Samsung to Deploy 50,000 NVIDIA GPUs in New AI Megafactory to Revolutionize Chip Manufacturing Read More
Semiconductor Angel Morales 10/23/25 Semiconductor Angel Morales 10/23/25 Samsung’s HBM4 Modules Reportedly Achieve 90% Logic Yield, Signaling Imminent Mass Production Read More
