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Samsung Memory Workers Reject 10% Bonus Offer as Strike Risk Builds Around a High Stakes AI Chip Battle
Semiconductor Angel Morales 5/10/26 Semiconductor Angel Morales 5/10/26

Samsung Memory Workers Reject 10% Bonus Offer as Strike Risk Builds Around a High Stakes AI Chip Battle

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Intel’s Real Comeback Test Starts Now as Lip Bu Tan Shifts From Momentum to Execution
AI, Semiconductor Angel Morales 5/10/26 AI, Semiconductor Angel Morales 5/10/26

Intel’s Real Comeback Test Starts Now as Lip Bu Tan Shifts From Momentum to Execution

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Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership
Semiconductor Angel Morales 5/9/26 Semiconductor Angel Morales 5/9/26

Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership

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AMD Reportedly Eyes Samsung 2nm as Backup Supply Path While TSMC Keeps the Lead for Venice
Semiconductor, AI, Hardware Angel Morales 5/8/26 Semiconductor, AI, Hardware Angel Morales 5/8/26

AMD Reportedly Eyes Samsung 2nm as Backup Supply Path While TSMC Keeps the Lead for Venice

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Arm Sees Agentic AI Demand Surge as AGI CPU Customer Orders Top 2 Billion Dollars by Fiscal 2028
Semiconductor, Hardware, AI Angel Morales 5/8/26 Semiconductor, Hardware, AI Angel Morales 5/8/26

Arm Sees Agentic AI Demand Surge as AGI CPU Customer Orders Top 2 Billion Dollars by Fiscal 2028

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NVIDIA and Corning Expand US Optical Manufacturing for AI With 10x Capacity Target and 3,000 New Jobs
AI, Semiconductor, Hardware Angel Morales 5/8/26 AI, Semiconductor, Hardware Angel Morales 5/8/26

NVIDIA and Corning Expand US Optical Manufacturing for AI With 10x Capacity Target and 3,000 New Jobs

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PCI-SIG Pushes PCIe 8.0 Toward 1 TB/s by 2028, Targeting the Bandwidth Wall Facing AI and Data Center Infrastructure
Semiconductor, Hardware, Technology Angel Morales 5/7/26 Semiconductor, Hardware, Technology Angel Morales 5/7/26

PCI-SIG Pushes PCIe 8.0 Toward 1 TB/s by 2028, Targeting the Bandwidth Wall Facing AI and Data Center Infrastructure

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Samsung’s Exynos 2800 Rumor Points to a Much Bigger GPU Ambition, but the Path Tracing Claim Needs Caution
Semiconductor, Hardware Angel Morales 5/7/26 Semiconductor, Hardware Angel Morales 5/7/26

Samsung’s Exynos 2800 Rumor Points to a Much Bigger GPU Ambition, but the Path Tracing Claim Needs Caution

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Lisa Su Says Agentic AI Is Adding to GPU Demand, Not Replacing It, as AMD Sees Server CPU Growth Accelerate
AI, Hardware, Semiconductor Angel Morales 5/7/26 AI, Hardware, Semiconductor Angel Morales 5/7/26

Lisa Su Says Agentic AI Is Adding to GPU Demand, Not Replacing It, as AMD Sees Server CPU Growth Accelerate

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AMD Starts Sampling MI450 GPUs as Lisa Su Says Biggest AI Deployments Are Now Landing on the Inference Side
AI, Semiconductor, Hardware Angel Morales 5/7/26 AI, Semiconductor, Hardware Angel Morales 5/7/26

AMD Starts Sampling MI450 GPUs as Lisa Su Says Biggest AI Deployments Are Now Landing on the Inference Side

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AMD Raises Server CPU Outlook to 120 Billion Dollars as Lisa Su Says EPYC Verano Is Built Specifically for AI Infrastructure
Hardware, AI, Semiconductor Angel Morales 5/7/26 Hardware, AI, Semiconductor Angel Morales 5/7/26

AMD Raises Server CPU Outlook to 120 Billion Dollars as Lisa Su Says EPYC Verano Is Built Specifically for AI Infrastructure

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Intel Reportedly Places Major Taiwan Equipment Orders to Expand EMIB Capacity as Advanced Packaging Becomes a Bigger AI Battleground
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Intel Reportedly Places Major Taiwan Equipment Orders to Expand EMIB Capacity as Advanced Packaging Becomes a Bigger AI Battleground

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Samsung’s 2nm Access Opens Doors, But DigiTimes Says Most Customers Still Treat It as TSMC Backup
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Samsung’s 2nm Access Opens Doors, But DigiTimes Says Most Customers Still Treat It as TSMC Backup

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Intel’s EMIB T Yield Progress Could Decide Google’s Next TPU Packaging Bet, Analyst Says
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Intel’s EMIB T Yield Progress Could Decide Google’s Next TPU Packaging Bet, Analyst Says

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Mobile DRAM Prices Could Nearly Double Again in Q2 2026 as Long Term Deals Lock In LPDDR at Up to 21 Dollars Per GB
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Mobile DRAM Prices Could Nearly Double Again in Q2 2026 as Long Term Deals Lock In LPDDR at Up to 21 Dollars Per GB

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NVIDIA Reportedly Pulls Co Packaged Optics Forward to 2028 With Feynman, Accelerating a Key AI Interconnect Shift
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

NVIDIA Reportedly Pulls Co Packaged Optics Forward to 2028 With Feynman, Accelerating a Key AI Interconnect Shift

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Intel and SoftBank’s ZAM Memory Targets the High Bandwidth AI Market With Bandwidth That Could Reach More Than Double HBM4
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Intel and SoftBank’s ZAM Memory Targets the High Bandwidth AI Market With Bandwidth That Could Reach More Than Double HBM4

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Sub 1nm Logic Roadmap Points to 2034 Debut, With 2D FET Era Targeted for 2043 to 2046
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Sub 1nm Logic Roadmap Points to 2034 Debut, With 2D FET Era Targeted for 2043 to 2046

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TSMC A16 Targets Up to 10% More Speed or 20% Lower Power Than N2P as Super Power Rail Moves Toward Q4 2026 Production
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

TSMC A16 Targets Up to 10% More Speed or 20% Lower Power Than N2P as Super Power Rail Moves Toward Q4 2026 Production

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Intel and AMD Push APX Forward as x86’s Next Big Performance Upgrade Without Major Area or Power Penalties
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Intel and AMD Push APX Forward as x86’s Next Big Performance Upgrade Without Major Area or Power Penalties

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