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Arm Sees Agentic AI Demand Surge as AGI CPU Customer Orders Top 2 Billion Dollars by Fiscal 2028
Semiconductor, Hardware, AI Angel Morales 5/8/26 Semiconductor, Hardware, AI Angel Morales 5/8/26

Arm Sees Agentic AI Demand Surge as AGI CPU Customer Orders Top 2 Billion Dollars by Fiscal 2028

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NVIDIA and Corning Expand US Optical Manufacturing for AI With 10x Capacity Target and 3,000 New Jobs
AI, Semiconductor, Hardware Angel Morales 5/8/26 AI, Semiconductor, Hardware Angel Morales 5/8/26

NVIDIA and Corning Expand US Optical Manufacturing for AI With 10x Capacity Target and 3,000 New Jobs

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PCI-SIG Pushes PCIe 8.0 Toward 1 TB/s by 2028, Targeting the Bandwidth Wall Facing AI and Data Center Infrastructure
Semiconductor, Hardware, Technology Angel Morales 5/7/26 Semiconductor, Hardware, Technology Angel Morales 5/7/26

PCI-SIG Pushes PCIe 8.0 Toward 1 TB/s by 2028, Targeting the Bandwidth Wall Facing AI and Data Center Infrastructure

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Samsung’s Exynos 2800 Rumor Points to a Much Bigger GPU Ambition, but the Path Tracing Claim Needs Caution
Semiconductor, Hardware Angel Morales 5/7/26 Semiconductor, Hardware Angel Morales 5/7/26

Samsung’s Exynos 2800 Rumor Points to a Much Bigger GPU Ambition, but the Path Tracing Claim Needs Caution

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Lisa Su Says Agentic AI Is Adding to GPU Demand, Not Replacing It, as AMD Sees Server CPU Growth Accelerate
AI, Hardware, Semiconductor Angel Morales 5/7/26 AI, Hardware, Semiconductor Angel Morales 5/7/26

Lisa Su Says Agentic AI Is Adding to GPU Demand, Not Replacing It, as AMD Sees Server CPU Growth Accelerate

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AMD Starts Sampling MI450 GPUs as Lisa Su Says Biggest AI Deployments Are Now Landing on the Inference Side
AI, Semiconductor, Hardware Angel Morales 5/7/26 AI, Semiconductor, Hardware Angel Morales 5/7/26

AMD Starts Sampling MI450 GPUs as Lisa Su Says Biggest AI Deployments Are Now Landing on the Inference Side

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AMD Raises Server CPU Outlook to 120 Billion Dollars as Lisa Su Says EPYC Verano Is Built Specifically for AI Infrastructure
Hardware, AI, Semiconductor Angel Morales 5/7/26 Hardware, AI, Semiconductor Angel Morales 5/7/26

AMD Raises Server CPU Outlook to 120 Billion Dollars as Lisa Su Says EPYC Verano Is Built Specifically for AI Infrastructure

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Intel Reportedly Places Major Taiwan Equipment Orders to Expand EMIB Capacity as Advanced Packaging Becomes a Bigger AI Battleground
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Intel Reportedly Places Major Taiwan Equipment Orders to Expand EMIB Capacity as Advanced Packaging Becomes a Bigger AI Battleground

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Samsung’s 2nm Access Opens Doors, But DigiTimes Says Most Customers Still Treat It as TSMC Backup
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Samsung’s 2nm Access Opens Doors, But DigiTimes Says Most Customers Still Treat It as TSMC Backup

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Intel’s EMIB T Yield Progress Could Decide Google’s Next TPU Packaging Bet, Analyst Says
Semiconductor Angel Morales 5/6/26 Semiconductor Angel Morales 5/6/26

Intel’s EMIB T Yield Progress Could Decide Google’s Next TPU Packaging Bet, Analyst Says

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Mobile DRAM Prices Could Nearly Double Again in Q2 2026 as Long Term Deals Lock In LPDDR at Up to 21 Dollars Per GB
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Mobile DRAM Prices Could Nearly Double Again in Q2 2026 as Long Term Deals Lock In LPDDR at Up to 21 Dollars Per GB

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NVIDIA Reportedly Pulls Co Packaged Optics Forward to 2028 With Feynman, Accelerating a Key AI Interconnect Shift
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

NVIDIA Reportedly Pulls Co Packaged Optics Forward to 2028 With Feynman, Accelerating a Key AI Interconnect Shift

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Intel and SoftBank’s ZAM Memory Targets the High Bandwidth AI Market With Bandwidth That Could Reach More Than Double HBM4
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Intel and SoftBank’s ZAM Memory Targets the High Bandwidth AI Market With Bandwidth That Could Reach More Than Double HBM4

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Sub 1nm Logic Roadmap Points to 2034 Debut, With 2D FET Era Targeted for 2043 to 2046
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Sub 1nm Logic Roadmap Points to 2034 Debut, With 2D FET Era Targeted for 2043 to 2046

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TSMC A16 Targets Up to 10% More Speed or 20% Lower Power Than N2P as Super Power Rail Moves Toward Q4 2026 Production
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

TSMC A16 Targets Up to 10% More Speed or 20% Lower Power Than N2P as Super Power Rail Moves Toward Q4 2026 Production

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Intel and AMD Push APX Forward as x86’s Next Big Performance Upgrade Without Major Area or Power Penalties
Semiconductor Angel Morales 5/5/26 Semiconductor Angel Morales 5/5/26

Intel and AMD Push APX Forward as x86’s Next Big Performance Upgrade Without Major Area or Power Penalties

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Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul
Semiconductor, Hardware Angel Morales 5/4/26 Semiconductor, Hardware Angel Morales 5/4/26

Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul

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Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26

Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger

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Intel Previews 18A-P as a Stronger Foundry Pitch With More Than 9% Higher Performance or More Than 18% Lower Power Than 18A
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26

Intel Previews 18A-P as a Stronger Foundry Pitch With More Than 9% Higher Performance or More Than 18% Lower Power Than 18A

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Intel EMIB Draws Fresh Attention as Analyst Cites 90% Yield and Intel Maps EMIB T Beyond 12x Reticle by 2028
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26

Intel EMIB Draws Fresh Attention as Analyst Cites 90% Yield and Intel Maps EMIB T Beyond 12x Reticle by 2028

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