Semiconductor, Hardware Angel Morales 5/4/26 Semiconductor, Hardware Angel Morales 5/4/26 Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul Read More Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger Read More Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Intel Previews 18A-P as a Stronger Foundry Pitch With More Than 9% Higher Performance or More Than 18% Lower Power Than 18A Read More Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Intel EMIB Draws Fresh Attention as Analyst Cites 90% Yield and Intel Maps EMIB T Beyond 12x Reticle by 2028 Read More AI, Hardware, Semiconductor Angel Morales 5/4/26 AI, Hardware, Semiconductor Angel Morales 5/4/26 AMD and Intel Push ACE as the New Standard Matrix Acceleration Path for x86 AI Workloads Read More Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Samsung Reportedly Passes 80% Yield on 4nm as Groq, IBM, and Baidu Orders Strengthen Foundry Recovery Read More Hardware, Semiconductor Angel Morales 5/4/26 Hardware, Semiconductor Angel Morales 5/4/26 AI Memory Boom Sends Profits Soaring for ADATA and Other Memory Makers as Tight Supply Becomes the New Normal Read More Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 TSMC 2nm Output Reportedly Set To Outpace 3nm By 45% As AI Demand Forces A Faster Ramp Read More Semiconductor, Hardware Angel Morales 4/30/26 Semiconductor, Hardware Angel Morales 4/30/26 Apple and Google Reportedly Eye Intel Foundry 18A P and EMIB as Intel’s Next Gen Node Push Gains Momentum Read More Semiconductor, Mobile, Gaming Angel Morales 4/30/26 Semiconductor, Mobile, Gaming Angel Morales 4/30/26 Samsung Pushes ENSS and NFG on Exynos 2600, But Better Mobile Game Support Still Looks Like the Missing Piece Read More Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel Backed Glass Substrate Packaging Could Reach Commercialization Within 3 Years As Amkor Signals Progress Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Taiwan NAND Maker Macronix Gains Momentum As Samsung’s MLC Exit Drives A Sharp Revenue Shift Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel, AMD And MediaTek Ramp CPU Output As AI Demand Pushes Prices Higher And Lead Times Longer Read More AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 CPU Demand Is So High That Intel Reportedly Boosted Margins by Selling Salvaged Xeon Chips Read More AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 NVIDIA Taps Taiwan’s Nanya Technology for Vera Rubin LPDDR5X Memory as Agentic AI Drives CPU Demand Read More Semiconductor Angel Morales 4/28/26 Semiconductor Angel Morales 4/28/26 TSMC Pushes 2nm and 3nm Expansion as AI Demand Creates Severe Advanced Node Supply Pressure Read More Semiconductor, Hardware Angel Morales 4/28/26 Semiconductor, Hardware Angel Morales 4/28/26 Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Could Boost Density by Up to 50% Read More Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory Read More Semiconductor, Industry Angel Morales 4/27/26 Semiconductor, Industry Angel Morales 4/27/26 TSMC CoWoS Supplier GPTC Denies China Technology Leak While Filing Lawsuit Against Former General Manager Read More Newer Posts Older Posts
Semiconductor, Hardware Angel Morales 5/4/26 Semiconductor, Hardware Angel Morales 5/4/26 Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul Read More
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger Read More
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Intel Previews 18A-P as a Stronger Foundry Pitch With More Than 9% Higher Performance or More Than 18% Lower Power Than 18A Read More
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Intel EMIB Draws Fresh Attention as Analyst Cites 90% Yield and Intel Maps EMIB T Beyond 12x Reticle by 2028 Read More
AI, Hardware, Semiconductor Angel Morales 5/4/26 AI, Hardware, Semiconductor Angel Morales 5/4/26 AMD and Intel Push ACE as the New Standard Matrix Acceleration Path for x86 AI Workloads Read More
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 Samsung Reportedly Passes 80% Yield on 4nm as Groq, IBM, and Baidu Orders Strengthen Foundry Recovery Read More
Hardware, Semiconductor Angel Morales 5/4/26 Hardware, Semiconductor Angel Morales 5/4/26 AI Memory Boom Sends Profits Soaring for ADATA and Other Memory Makers as Tight Supply Becomes the New Normal Read More
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26 TSMC 2nm Output Reportedly Set To Outpace 3nm By 45% As AI Demand Forces A Faster Ramp Read More
Semiconductor, Hardware Angel Morales 4/30/26 Semiconductor, Hardware Angel Morales 4/30/26 Apple and Google Reportedly Eye Intel Foundry 18A P and EMIB as Intel’s Next Gen Node Push Gains Momentum Read More
Semiconductor, Mobile, Gaming Angel Morales 4/30/26 Semiconductor, Mobile, Gaming Angel Morales 4/30/26 Samsung Pushes ENSS and NFG on Exynos 2600, But Better Mobile Game Support Still Looks Like the Missing Piece Read More
Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel Backed Glass Substrate Packaging Could Reach Commercialization Within 3 Years As Amkor Signals Progress Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Taiwan NAND Maker Macronix Gains Momentum As Samsung’s MLC Exit Drives A Sharp Revenue Shift Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel, AMD And MediaTek Ramp CPU Output As AI Demand Pushes Prices Higher And Lead Times Longer Read More
AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 CPU Demand Is So High That Intel Reportedly Boosted Margins by Selling Salvaged Xeon Chips Read More
AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 NVIDIA Taps Taiwan’s Nanya Technology for Vera Rubin LPDDR5X Memory as Agentic AI Drives CPU Demand Read More
Semiconductor Angel Morales 4/28/26 Semiconductor Angel Morales 4/28/26 TSMC Pushes 2nm and 3nm Expansion as AI Demand Creates Severe Advanced Node Supply Pressure Read More
Semiconductor, Hardware Angel Morales 4/28/26 Semiconductor, Hardware Angel Morales 4/28/26 Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Could Boost Density by Up to 50% Read More
Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory Read More
Semiconductor, Industry Angel Morales 4/27/26 Semiconductor, Industry Angel Morales 4/27/26 TSMC CoWoS Supplier GPTC Denies China Technology Leak While Filing Lawsuit Against Former General Manager Read More
