Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel Backed Glass Substrate Packaging Could Reach Commercialization Within 3 Years As Amkor Signals Progress Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Taiwan NAND Maker Macronix Gains Momentum As Samsung’s MLC Exit Drives A Sharp Revenue Shift Read More Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel, AMD And MediaTek Ramp CPU Output As AI Demand Pushes Prices Higher And Lead Times Longer Read More AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 CPU Demand Is So High That Intel Reportedly Boosted Margins by Selling Salvaged Xeon Chips Read More AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 NVIDIA Taps Taiwan’s Nanya Technology for Vera Rubin LPDDR5X Memory as Agentic AI Drives CPU Demand Read More Semiconductor Angel Morales 4/28/26 Semiconductor Angel Morales 4/28/26 TSMC Pushes 2nm and 3nm Expansion as AI Demand Creates Severe Advanced Node Supply Pressure Read More Semiconductor, Hardware Angel Morales 4/28/26 Semiconductor, Hardware Angel Morales 4/28/26 Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Could Boost Density by Up to 50% Read More Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory Read More Semiconductor, Industry Angel Morales 4/27/26 Semiconductor, Industry Angel Morales 4/27/26 TSMC CoWoS Supplier GPTC Denies China Technology Leak While Filing Lawsuit Against Former General Manager Read More Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 Intel Xe GPU Roadmap Points to Xe3P in 2026, Xe4 in 2027, and Xe Next in 2028 Read More AI, Hardware, Semiconductor Angel Morales 4/27/26 AI, Hardware, Semiconductor Angel Morales 4/27/26 Qualcomm’s Rumored Datacenter CPU Arrives at the Perfect Moment as Agentic AI Pushes CPU Demand Back Into Focus Read More Semiconductor, AI, Hardware Angel Morales 4/27/26 Semiconductor, AI, Hardware Angel Morales 4/27/26 Meta Adds Tens of Millions of AWS Graviton Cores as Agentic AI Becomes a Major CPU Story Read More Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 Intel Just Had One Of Its Biggest Earnings Calls Ever, And The Market Finally Noticed Read More Semiconductor Angel Morales 4/27/26 Semiconductor Angel Morales 4/27/26 Intel’s ZAM Memory Gets Major Support From Japan as a Potential Low Power HBM Alternative Read More Mobile, Semiconductor Angel Morales 4/27/26 Mobile, Semiconductor Angel Morales 4/27/26 Samsung Faces Major Labor Pressure After Union Rally Reportedly Disrupts Foundry and Memory Output Read More Semiconductor Angel Morales 4/27/26 Semiconductor Angel Morales 4/27/26 Tesla’s 14A Win Gives Intel Foundry a Major Confidence Boost as 18AP and 14A Customer Engagements Expand Read More Semiconductor, Hardware Angel Morales 4/24/26 Semiconductor, Hardware Angel Morales 4/24/26 Google TurboQuant Will Not Solve the AI Memory Crunch as Rising Efficiency Keeps Expanding Overall Demand Read More Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 Rambus Quietly Builds a Core Piece of the AI Server Memory Shift as SOCAMM2 Gains Momentum Read More Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 TSMC Previews A13 and A12 for 2029 While Extending Current EUV Further Instead of Moving to High NA Read More Newer Posts Older Posts
Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel Backed Glass Substrate Packaging Could Reach Commercialization Within 3 Years As Amkor Signals Progress Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Taiwan NAND Maker Macronix Gains Momentum As Samsung’s MLC Exit Drives A Sharp Revenue Shift Read More
Semiconductor, Hardware Angel Morales 4/29/26 Semiconductor, Hardware Angel Morales 4/29/26 Intel, AMD And MediaTek Ramp CPU Output As AI Demand Pushes Prices Higher And Lead Times Longer Read More
AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 CPU Demand Is So High That Intel Reportedly Boosted Margins by Selling Salvaged Xeon Chips Read More
AI, Semiconductor, Hardware Angel Morales 4/28/26 AI, Semiconductor, Hardware Angel Morales 4/28/26 NVIDIA Taps Taiwan’s Nanya Technology for Vera Rubin LPDDR5X Memory as Agentic AI Drives CPU Demand Read More
Semiconductor Angel Morales 4/28/26 Semiconductor Angel Morales 4/28/26 TSMC Pushes 2nm and 3nm Expansion as AI Demand Creates Severe Advanced Node Supply Pressure Read More
Semiconductor, Hardware Angel Morales 4/28/26 Semiconductor, Hardware Angel Morales 4/28/26 Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Could Boost Density by Up to 50% Read More
Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory Read More
Semiconductor, Industry Angel Morales 4/27/26 Semiconductor, Industry Angel Morales 4/27/26 TSMC CoWoS Supplier GPTC Denies China Technology Leak While Filing Lawsuit Against Former General Manager Read More
Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 Intel Xe GPU Roadmap Points to Xe3P in 2026, Xe4 in 2027, and Xe Next in 2028 Read More
AI, Hardware, Semiconductor Angel Morales 4/27/26 AI, Hardware, Semiconductor Angel Morales 4/27/26 Qualcomm’s Rumored Datacenter CPU Arrives at the Perfect Moment as Agentic AI Pushes CPU Demand Back Into Focus Read More
Semiconductor, AI, Hardware Angel Morales 4/27/26 Semiconductor, AI, Hardware Angel Morales 4/27/26 Meta Adds Tens of Millions of AWS Graviton Cores as Agentic AI Becomes a Major CPU Story Read More
Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26 Intel Just Had One Of Its Biggest Earnings Calls Ever, And The Market Finally Noticed Read More
Semiconductor Angel Morales 4/27/26 Semiconductor Angel Morales 4/27/26 Intel’s ZAM Memory Gets Major Support From Japan as a Potential Low Power HBM Alternative Read More
Mobile, Semiconductor Angel Morales 4/27/26 Mobile, Semiconductor Angel Morales 4/27/26 Samsung Faces Major Labor Pressure After Union Rally Reportedly Disrupts Foundry and Memory Output Read More
Semiconductor Angel Morales 4/27/26 Semiconductor Angel Morales 4/27/26 Tesla’s 14A Win Gives Intel Foundry a Major Confidence Boost as 18AP and 14A Customer Engagements Expand Read More
Semiconductor, Hardware Angel Morales 4/24/26 Semiconductor, Hardware Angel Morales 4/24/26 Google TurboQuant Will Not Solve the AI Memory Crunch as Rising Efficiency Keeps Expanding Overall Demand Read More
Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 Rambus Quietly Builds a Core Piece of the AI Server Memory Shift as SOCAMM2 Gains Momentum Read More
Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 TSMC Previews A13 and A12 for 2029 While Extending Current EUV Further Instead of Moving to High NA Read More
