Semiconductor, Hardware Angel Morales 2/17/26 Semiconductor, Hardware Angel Morales 2/17/26 CXMT and YMTC Reportedly Removed From Pentagon Section 1260H List Read More Semiconductor, Hardware Angel Morales 2/16/26 Semiconductor, Hardware Angel Morales 2/16/26 Even China’s Largest Chip Company SMIC Warns DRAM Shortages Are Forcing Customers to Rethink Chip Orders Read More Semiconductor Angel Morales 2/14/26 Semiconductor Angel Morales 2/14/26 Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom Read More Semiconductor, Hardware Angel Morales 2/13/26 Semiconductor, Hardware Angel Morales 2/13/26 Samsung Begins Mass Production and Shipments of HBM4 Read More Semiconductor Angel Morales 2/13/26 Semiconductor Angel Morales 2/13/26 Rapidus Accelerates 2nm Push and Targets 60,000 WPM by 2028, Setting Up a Japan Foundry Face Off with TSMC Read More Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26 Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits Read More Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26 China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing Read More Semiconductor Angel Morales 2/11/26 Semiconductor Angel Morales 2/11/26 TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers Read More Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More Semiconductor Angel Morales 2/9/26 Semiconductor Angel Morales 2/9/26 Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win Read More Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26 DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink Read More Semiconductor, Hardware Angel Morales 2/6/26 Semiconductor, Hardware Angel Morales 2/6/26 HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory Read More Semiconductor Angel Morales 2/5/26 Semiconductor Angel Morales 2/5/26 Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation Read More Semiconductor Angel Morales 2/4/26 Semiconductor Angel Morales 2/4/26 SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development Read More Semiconductor Angel Morales 2/3/26 Semiconductor Angel Morales 2/3/26 TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation Read More Semiconductor, Business Angel Morales 2/3/26 Semiconductor, Business Angel Morales 2/3/26 TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom Read More Semiconductor, Business Angel Morales 2/2/26 Semiconductor, Business Angel Morales 2/2/26 NVIDIA’s Trillion Dollar Dinner With Taiwanese Partners Highlights Why Jensen Huang Keeps NVIDIA Ahead in the AI Supply Chain Read More Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26 TSMC Founder Morris Chang Reappears in Taipei to Meet NVIDIA CEO Jensen Huang Read More Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26 AMD Zen 6 CCD Reportedly Measures 76mm2, Slightly Bigger Than Zen 5 While Packing More Cores Read More Semiconductor Angel Morales 2/2/26 Semiconductor Angel Morales 2/2/26 YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook Read More Newer Posts Older Posts
Semiconductor, Hardware Angel Morales 2/17/26 Semiconductor, Hardware Angel Morales 2/17/26 CXMT and YMTC Reportedly Removed From Pentagon Section 1260H List Read More
Semiconductor, Hardware Angel Morales 2/16/26 Semiconductor, Hardware Angel Morales 2/16/26 Even China’s Largest Chip Company SMIC Warns DRAM Shortages Are Forcing Customers to Rethink Chip Orders Read More
Semiconductor Angel Morales 2/14/26 Semiconductor Angel Morales 2/14/26 Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom Read More
Semiconductor, Hardware Angel Morales 2/13/26 Semiconductor, Hardware Angel Morales 2/13/26 Samsung Begins Mass Production and Shipments of HBM4 Read More
Semiconductor Angel Morales 2/13/26 Semiconductor Angel Morales 2/13/26 Rapidus Accelerates 2nm Push and Targets 60,000 WPM by 2028, Setting Up a Japan Foundry Face Off with TSMC Read More
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26 Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits Read More
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26 China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing Read More
Semiconductor Angel Morales 2/11/26 Semiconductor Angel Morales 2/11/26 TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers Read More
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More
Semiconductor Angel Morales 2/9/26 Semiconductor Angel Morales 2/9/26 Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win Read More
Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26 DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink Read More
Semiconductor, Hardware Angel Morales 2/6/26 Semiconductor, Hardware Angel Morales 2/6/26 HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory Read More
Semiconductor Angel Morales 2/5/26 Semiconductor Angel Morales 2/5/26 Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation Read More
Semiconductor Angel Morales 2/4/26 Semiconductor Angel Morales 2/4/26 SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development Read More
Semiconductor Angel Morales 2/3/26 Semiconductor Angel Morales 2/3/26 TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation Read More
Semiconductor, Business Angel Morales 2/3/26 Semiconductor, Business Angel Morales 2/3/26 TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom Read More
Semiconductor, Business Angel Morales 2/2/26 Semiconductor, Business Angel Morales 2/2/26 NVIDIA’s Trillion Dollar Dinner With Taiwanese Partners Highlights Why Jensen Huang Keeps NVIDIA Ahead in the AI Supply Chain Read More
Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26 TSMC Founder Morris Chang Reappears in Taipei to Meet NVIDIA CEO Jensen Huang Read More
Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26 AMD Zen 6 CCD Reportedly Measures 76mm2, Slightly Bigger Than Zen 5 While Packing More Cores Read More
Semiconductor Angel Morales 2/2/26 Semiconductor Angel Morales 2/2/26 YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook Read More
