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Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious
Semiconductor Angel Morales 2/24/26 Semiconductor Angel Morales 2/24/26

Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious

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ASML Targets 50% Higher Chip Output by 2030 With 1 Kilowatt EUV Light Source Upgrade Plan
Semiconductor Angel Morales 2/24/26 Semiconductor Angel Morales 2/24/26

ASML Targets 50% Higher Chip Output by 2030 With 1 Kilowatt EUV Light Source Upgrade Plan

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Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum
Hardware, Semiconductor Angel Morales 2/24/26 Hardware, Semiconductor Angel Morales 2/24/26

Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum

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Latest US Taiwan Trade Agreement Aims to De Risk Americas Chip Supply Chain, With Tariff Clarity in Focus
Semiconductor Angel Morales 2/18/26 Semiconductor Angel Morales 2/18/26

Latest US Taiwan Trade Agreement Aims to De Risk Americas Chip Supply Chain, With Tariff Clarity in Focus

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CXMT and YMTC Reportedly Removed From Pentagon Section 1260H List
Semiconductor, Hardware Angel Morales 2/17/26 Semiconductor, Hardware Angel Morales 2/17/26

CXMT and YMTC Reportedly Removed From Pentagon Section 1260H List

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Even China’s Largest Chip Company SMIC Warns DRAM Shortages Are Forcing Customers to Rethink Chip Orders
Semiconductor, Hardware Angel Morales 2/16/26 Semiconductor, Hardware Angel Morales 2/16/26

Even China’s Largest Chip Company SMIC Warns DRAM Shortages Are Forcing Customers to Rethink Chip Orders

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Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom
Semiconductor Angel Morales 2/14/26 Semiconductor Angel Morales 2/14/26

Samsung HBM4 Enters the Vera Rubin Era as Commercial Shipments Hit 11.7 Gbps and Target 13.0 Gbps Headroom

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Samsung Begins Mass Production and Shipments of HBM4
Semiconductor, Hardware Angel Morales 2/13/26 Semiconductor, Hardware Angel Morales 2/13/26

Samsung Begins Mass Production and Shipments of HBM4

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Rapidus Accelerates 2nm Push and Targets 60,000 WPM by 2028, Setting Up a Japan Foundry Face Off with TSMC
Semiconductor Angel Morales 2/13/26 Semiconductor Angel Morales 2/13/26

Rapidus Accelerates 2nm Push and Targets 60,000 WPM by 2028, Setting Up a Japan Foundry Face Off with TSMC

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Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26

Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits

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China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26

China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing

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TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers
Semiconductor Angel Morales 2/11/26 Semiconductor Angel Morales 2/11/26

TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers

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Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26

Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era

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Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win
Semiconductor Angel Morales 2/9/26 Semiconductor Angel Morales 2/9/26

Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win

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DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink
Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26

DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink

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HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory
Semiconductor, Hardware Angel Morales 2/6/26 Semiconductor, Hardware Angel Morales 2/6/26

HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory

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Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation
Semiconductor Angel Morales 2/5/26 Semiconductor Angel Morales 2/5/26

Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation

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SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development
Semiconductor Angel Morales 2/4/26 Semiconductor Angel Morales 2/4/26

SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development

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TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation
Semiconductor Angel Morales 2/3/26 Semiconductor Angel Morales 2/3/26

TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation

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TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom
Semiconductor, Business Angel Morales 2/3/26 Semiconductor, Business Angel Morales 2/3/26

TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom

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