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China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26

China’s Top DRAM Maker CXMT Reportedly Shifts 20% of Output Toward HBM3, Signaling a Bigger AI First Pivot and Less Relief for Gamer Memory Pricing

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TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers
Semiconductor Angel Morales 2/11/26 Semiconductor Angel Morales 2/11/26

TSMC Reportedly Spared From Upcoming U.S. Chip Tariffs After Arizona Expansion Plans, With Exemptions Flowing Through to Major U.S. Tech Customers

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Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26

Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era

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Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win
Semiconductor Angel Morales 2/9/26 Semiconductor Angel Morales 2/9/26

Intel PowerVia and BSPDN Strengthen the 18A Value Proposition, But External Customer Volume Still Looks Like a Later Win

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DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink
Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26

DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink

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HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory
Semiconductor, Hardware Angel Morales 2/6/26 Semiconductor, Hardware Angel Morales 2/6/26

HP, Dell, Acer, and ASUS Reportedly Validate CXMT DDR5 as DRAM Shortages Push OEMs Toward Chinese Memory

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Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation
Semiconductor Angel Morales 2/5/26 Semiconductor Angel Morales 2/5/26

Intel and SoftBank SAIMEMORY Team Up on Z Angle Memory as Team Blue Eyes a Return to Next Generation DRAM Innovation

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SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development
Semiconductor Angel Morales 2/4/26 Semiconductor Angel Morales 2/4/26

SMIC Plans to Strengthen Cooperation With OSAT Partners to Accelerate Advanced Packaging Development

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TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation
Semiconductor Angel Morales 2/3/26 Semiconductor Angel Morales 2/3/26

TSMC 2nm Capacity Is Heavily Contested as Mobile and HPC Customers Collide on N2 Allocation

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TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom
Semiconductor, Business Angel Morales 2/3/26 Semiconductor, Business Angel Morales 2/3/26

TSMC Must Grow Over 100% in 10 Years Just to Cover NVIDIA Demand, Says Jensen Huang, Signaling the Next Scale Phase of the AI Boom

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NVIDIA’s Trillion Dollar Dinner With Taiwanese Partners Highlights Why Jensen Huang Keeps NVIDIA Ahead in the AI Supply Chain
Semiconductor, Business Angel Morales 2/2/26 Semiconductor, Business Angel Morales 2/2/26

NVIDIA’s Trillion Dollar Dinner With Taiwanese Partners Highlights Why Jensen Huang Keeps NVIDIA Ahead in the AI Supply Chain

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TSMC Founder Morris Chang Reappears in Taipei to Meet NVIDIA CEO Jensen Huang
Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26

TSMC Founder Morris Chang Reappears in Taipei to Meet NVIDIA CEO Jensen Huang

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AMD Zen 6 CCD Reportedly Measures 76mm2, Slightly Bigger Than Zen 5 While Packing More Cores
Semiconductor, Hardware Angel Morales 2/2/26 Semiconductor, Hardware Angel Morales 2/2/26

AMD Zen 6 CCD Reportedly Measures 76mm2, Slightly Bigger Than Zen 5 While Packing More Cores

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YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook
Semiconductor Angel Morales 2/2/26 Semiconductor Angel Morales 2/2/26

YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook

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NVIDIA CEO Pushes Back on “Shift” Narrative, Says US Chip Output Targets Mean TSMC Must Add Capacity, Not Abandon Taiwan
Semiconductor, Business Angel Morales 1/30/26 Semiconductor, Business Angel Morales 1/30/26

NVIDIA CEO Pushes Back on “Shift” Narrative, Says US Chip Output Targets Mean TSMC Must Add Capacity, Not Abandon Taiwan

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Elon Musk Doubles Down on Tesla TeraFab Vision to Build Logic, Memory, and Packaging Under One Roof
Semiconductor, Hardware Angel Morales 1/30/26 Semiconductor, Hardware Angel Morales 1/30/26

Elon Musk Doubles Down on Tesla TeraFab Vision to Build Logic, Memory, and Packaging Under One Roof

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Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June
Hardware, Semiconductor Angel Morales 1/27/26 Hardware, Semiconductor Angel Morales 1/27/26

Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June

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Intel and NVIDIA Confirm Custom Xeon With NVLink, Intel Reaffirms 16 Channel Diamond Rapids, Coral Rapids With SMT, and Nova Lake Landing Late 2026
AI, Hardware, Semiconductor Angel Morales 1/26/26 AI, Hardware, Semiconductor Angel Morales 1/26/26

Intel and NVIDIA Confirm Custom Xeon With NVLink, Intel Reaffirms 16 Channel Diamond Rapids, Coral Rapids With SMT, and Nova Lake Landing Late 2026

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Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging
Hardware, Semiconductor Angel Morales 1/23/26 Hardware, Semiconductor Angel Morales 1/23/26

Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging

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Intel Touts New SHIELD Defense Contract Positioning as the United States Expands a $151B Missile Defense Acquisition
Semiconductor, Hardware Angel Morales 1/21/26 Semiconductor, Hardware Angel Morales 1/21/26

Intel Touts New SHIELD Defense Contract Positioning as the United States Expands a $151B Missile Defense Acquisition

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