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YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook
Semiconductor Angel Morales 2/2/26 Semiconductor Angel Morales 2/2/26

YMTC Reportedly Fast Tracks Wuhan NAND Fab Push as AI Storage Demand Rewrites the Global Supply Playbook

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NVIDIA CEO Pushes Back on “Shift” Narrative, Says US Chip Output Targets Mean TSMC Must Add Capacity, Not Abandon Taiwan
Semiconductor, Business Angel Morales 1/30/26 Semiconductor, Business Angel Morales 1/30/26

NVIDIA CEO Pushes Back on “Shift” Narrative, Says US Chip Output Targets Mean TSMC Must Add Capacity, Not Abandon Taiwan

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Elon Musk Doubles Down on Tesla TeraFab Vision to Build Logic, Memory, and Packaging Under One Roof
Semiconductor, Hardware Angel Morales 1/30/26 Semiconductor, Hardware Angel Morales 1/30/26

Elon Musk Doubles Down on Tesla TeraFab Vision to Build Logic, Memory, and Packaging Under One Roof

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Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June
Hardware, Semiconductor Angel Morales 1/27/26 Hardware, Semiconductor Angel Morales 1/27/26

Samsung Reportedly Clears HBM4 Verification and Lines Up Early Placement in NVIDIA Vera Rubin, With Supply Timing as Soon as June

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Intel and NVIDIA Confirm Custom Xeon With NVLink, Intel Reaffirms 16 Channel Diamond Rapids, Coral Rapids With SMT, and Nova Lake Landing Late 2026
AI, Hardware, Semiconductor Angel Morales 1/26/26 AI, Hardware, Semiconductor Angel Morales 1/26/26

Intel and NVIDIA Confirm Custom Xeon With NVLink, Intel Reaffirms 16 Channel Diamond Rapids, Coral Rapids With SMT, and Nova Lake Landing Late 2026

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Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging
Hardware, Semiconductor Angel Morales 1/23/26 Hardware, Semiconductor Angel Morales 1/23/26

Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging

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Intel Touts New SHIELD Defense Contract Positioning as the United States Expands a $151B Missile Defense Acquisition
Semiconductor, Hardware Angel Morales 1/21/26 Semiconductor, Hardware Angel Morales 1/21/26

Intel Touts New SHIELD Defense Contract Positioning as the United States Expands a $151B Missile Defense Acquisition

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Samsung Foundry Gains Momentum as a Secondary United States Option, Deutsche Bank Note Highlights Edge Over Intel Foundry
Semiconductor Angel Morales 1/20/26 Semiconductor Angel Morales 1/20/26

Samsung Foundry Gains Momentum as a Secondary United States Option, Deutsche Bank Note Highlights Edge Over Intel Foundry

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Tesla CEO Signals Push Toward World’s Highest Volume AI Chips as Dojo3 Returns and AI5 Claims Spark Debate
Semiconductor Angel Morales 1/20/26 Semiconductor Angel Morales 1/20/26

Tesla CEO Signals Push Toward World’s Highest Volume AI Chips as Dojo3 Returns and AI5 Claims Spark Debate

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Samsung and SK hynix Could Face New United States Memory Tariffs
Semiconductor, Hardware Angel Morales 1/19/26 Semiconductor, Hardware Angel Morales 1/19/26

Samsung and SK hynix Could Face New United States Memory Tariffs

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Micron’s 1.8 Billion Dollar PSMC Deal Could Add Up to 15 Percent More DRAM Output, But Relief Still Looks Like a 2027 Story
Semiconductor Angel Morales 1/19/26 Semiconductor Angel Morales 1/19/26

Micron’s 1.8 Billion Dollar PSMC Deal Could Add Up to 15 Percent More DRAM Output, But Relief Still Looks Like a 2027 Story

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TSMC and Taiwan to Pour $500 Billion Into U.S. Chipmaking, Yet the Most Advanced Chips Still Remain Strictly Offshore
Semiconductor Angel Morales 1/19/26 Semiconductor Angel Morales 1/19/26

TSMC and Taiwan to Pour $500 Billion Into U.S. Chipmaking, Yet the Most Advanced Chips Still Remain Strictly Offshore

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TSMC Signals The AI Demand Wave Is Still Accelerating, With CapEx Guidance Set To Hit Record Highs
Semiconductor Angel Morales 1/16/26 Semiconductor Angel Morales 1/16/26

TSMC Signals The AI Demand Wave Is Still Accelerating, With CapEx Guidance Set To Hit Record Highs

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Intel Positions EMIB As A Stronger Alternative To Traditional 2.5D Packaging
Semiconductor Angel Morales 1/16/26 Semiconductor Angel Morales 1/16/26

Intel Positions EMIB As A Stronger Alternative To Traditional 2.5D Packaging

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Samsung Reportedly Hits 50% Yield On 2nm GAA, Shifts Partner Messaging Toward SF2P Second Generation Node
Semiconductor Angel Morales 1/16/26 Semiconductor Angel Morales 1/16/26

Samsung Reportedly Hits 50% Yield On 2nm GAA, Shifts Partner Messaging Toward SF2P Second Generation Node

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TSMC Chairman C.C. Wei Says Capital Alone Cannot Win Advanced Node Manufacturing, Implying Intel Foundry Still Faces Execution Gaps
Semiconductor Angel Morales 1/16/26 Semiconductor Angel Morales 1/16/26

TSMC Chairman C.C. Wei Says Capital Alone Cannot Win Advanced Node Manufacturing, Implying Intel Foundry Still Faces Execution Gaps

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SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab
Semiconductor Angel Morales 1/14/26 Semiconductor Angel Morales 1/14/26

SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab

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Innosilicon LPDDR6 and LPDDR5X Memory Controller IP Delivered To First Customers, Targeting Up To 14.4 Gbps
Semiconductor Angel Morales 1/13/26 Semiconductor Angel Morales 1/13/26

Innosilicon LPDDR6 and LPDDR5X Memory Controller IP Delivered To First Customers, Targeting Up To 14.4 Gbps

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Qualcomm and Google Expand Snapdragon Digital Chassis Collaboration With Gemini Powered Android Automotive Integration
Semiconductor Angel Morales 1/9/26 Semiconductor Angel Morales 1/9/26

Qualcomm and Google Expand Snapdragon Digital Chassis Collaboration With Gemini Powered Android Automotive Integration

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Elon Musk Says He Could Be Spotted With a Cigar In His TeraFab, Downplaying Cleanroom Requirements
Semiconductor Angel Morales 1/9/26 Semiconductor Angel Morales 1/9/26

Elon Musk Says He Could Be Spotted With a Cigar In His TeraFab, Downplaying Cleanroom Requirements

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