Semiconductor Angel Morales 12/20/25 Semiconductor Angel Morales 12/20/25 Despite Massive TSMC Investments, the United States Will Not Receive the Most Advanced Chips Read More Semiconductor, Hardware Angel Morales 12/20/25 Semiconductor, Hardware Angel Morales 12/20/25 Global DRAM Shortage Reaches Critical Point as Samsung Probes Alleged Bribery to Divert Memory Supply Read More Semiconductor Angel Morales 12/19/25 Semiconductor Angel Morales 12/19/25 Apple’s Server Chip May Rely on Intel EMIB Packaging as TSMC CoWoS Capacity Tightens Read More Hardware, Semiconductor Angel Morales 12/19/25 Hardware, Semiconductor Angel Morales 12/19/25 G.Skill Points to the AI Industry as the Main Driver Behind Sky High DRAM Prices Read More Semiconductor Angel Morales 12/18/25 Semiconductor Angel Morales 12/18/25 China EUV Prototype Reportedly Operational and Could Tape Out Chips by 2030 Using Legacy ASML Components Read More Semiconductor Angel Morales 12/18/25 Semiconductor Angel Morales 12/18/25 Samsung Annual Operating Profit Projected to Reach 73Billion Dollars in 2026 as DRAM and NAND Prices Surge Read More Semiconductor Angel Morales 12/17/25 Semiconductor Angel Morales 12/17/25 TSMC 2nm Capacity Reportedly Fully Booked Through 2026 as GAA Demand Surges Read More Semiconductor, Hardware Angel Morales 12/17/25 Semiconductor, Hardware Angel Morales 12/17/25 NVIDIA and SK hynix Co Develop AI SSD to Transform Inference Performance and NAND Architecture Read More Semiconductor, Hardware Angel Morales 12/15/25 Semiconductor, Hardware Angel Morales 12/15/25 SK Hynix Warns DRAM Supply Tightness Will Persist Through 2028 as AI Demand Reshapes the Memory Market Read More AI, Semiconductor Angel Morales 12/10/25 AI, Semiconductor Angel Morales 12/10/25 NVIDIA Secures Majority of TSMC’s Advanced Packaging Capacity for Years, Creating Tight Supply for Competitors Read More Semiconductor Angel Morales 12/9/25 Semiconductor Angel Morales 12/9/25 TSMC’s Advanced Packaging Capacity Is So Constrained That the Company Is Now Outsourcing Orders to Meet Explosive Demand Read More Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC’s Arizona Fab Sends Engineers to Taiwan for 3nm and 2nm Production Training as Demand for Next Gen Nodes Surges Read More Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC Accelerates Plans to Bring Advanced Packaging to the United States as CoWoS Demand Surges Read More Semiconductor Angel Morales 12/5/25 Semiconductor Angel Morales 12/5/25 Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging Read More Semiconductor, Announcement Angel Morales 12/3/25 Semiconductor, Announcement Angel Morales 12/3/25 Amazon Positions Itself Fully in the ASIC Race With New Trainium3 UltraServers and Next Generation Trainium4 Chips Read More Semiconductor Angel Morales 12/3/25 Semiconductor Angel Morales 12/3/25 After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars Read More Semiconductor Angel Morales 12/2/25 Semiconductor Angel Morales 12/2/25 Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand Read More Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 Intel’s Entry Level Wildcat Lake CPUs to Receive a Refresh With Up to Eight Core Options Read More Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 NVIDIA Feynman GPUs Set to Adopt TSMC A16 One Point Six Nanometer Process Technology Read More Semiconductor, Mobile Angel Morales 12/2/25 Semiconductor, Mobile Angel Morales 12/2/25 Samsung Reportedly Rejects DRAM Supply Request from Its Own Mobile Experience Division as It Prioritizes Profitability Read More Newer Posts Older Posts
Semiconductor Angel Morales 12/20/25 Semiconductor Angel Morales 12/20/25 Despite Massive TSMC Investments, the United States Will Not Receive the Most Advanced Chips Read More
Semiconductor, Hardware Angel Morales 12/20/25 Semiconductor, Hardware Angel Morales 12/20/25 Global DRAM Shortage Reaches Critical Point as Samsung Probes Alleged Bribery to Divert Memory Supply Read More
Semiconductor Angel Morales 12/19/25 Semiconductor Angel Morales 12/19/25 Apple’s Server Chip May Rely on Intel EMIB Packaging as TSMC CoWoS Capacity Tightens Read More
Hardware, Semiconductor Angel Morales 12/19/25 Hardware, Semiconductor Angel Morales 12/19/25 G.Skill Points to the AI Industry as the Main Driver Behind Sky High DRAM Prices Read More
Semiconductor Angel Morales 12/18/25 Semiconductor Angel Morales 12/18/25 China EUV Prototype Reportedly Operational and Could Tape Out Chips by 2030 Using Legacy ASML Components Read More
Semiconductor Angel Morales 12/18/25 Semiconductor Angel Morales 12/18/25 Samsung Annual Operating Profit Projected to Reach 73Billion Dollars in 2026 as DRAM and NAND Prices Surge Read More
Semiconductor Angel Morales 12/17/25 Semiconductor Angel Morales 12/17/25 TSMC 2nm Capacity Reportedly Fully Booked Through 2026 as GAA Demand Surges Read More
Semiconductor, Hardware Angel Morales 12/17/25 Semiconductor, Hardware Angel Morales 12/17/25 NVIDIA and SK hynix Co Develop AI SSD to Transform Inference Performance and NAND Architecture Read More
Semiconductor, Hardware Angel Morales 12/15/25 Semiconductor, Hardware Angel Morales 12/15/25 SK Hynix Warns DRAM Supply Tightness Will Persist Through 2028 as AI Demand Reshapes the Memory Market Read More
AI, Semiconductor Angel Morales 12/10/25 AI, Semiconductor Angel Morales 12/10/25 NVIDIA Secures Majority of TSMC’s Advanced Packaging Capacity for Years, Creating Tight Supply for Competitors Read More
Semiconductor Angel Morales 12/9/25 Semiconductor Angel Morales 12/9/25 TSMC’s Advanced Packaging Capacity Is So Constrained That the Company Is Now Outsourcing Orders to Meet Explosive Demand Read More
Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC’s Arizona Fab Sends Engineers to Taiwan for 3nm and 2nm Production Training as Demand for Next Gen Nodes Surges Read More
Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC Accelerates Plans to Bring Advanced Packaging to the United States as CoWoS Demand Surges Read More
Semiconductor Angel Morales 12/5/25 Semiconductor Angel Morales 12/5/25 Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging Read More
Semiconductor, Announcement Angel Morales 12/3/25 Semiconductor, Announcement Angel Morales 12/3/25 Amazon Positions Itself Fully in the ASIC Race With New Trainium3 UltraServers and Next Generation Trainium4 Chips Read More
Semiconductor Angel Morales 12/3/25 Semiconductor Angel Morales 12/3/25 After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars Read More
Semiconductor Angel Morales 12/2/25 Semiconductor Angel Morales 12/2/25 Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand Read More
Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 Intel’s Entry Level Wildcat Lake CPUs to Receive a Refresh With Up to Eight Core Options Read More
Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 NVIDIA Feynman GPUs Set to Adopt TSMC A16 One Point Six Nanometer Process Technology Read More
Semiconductor, Mobile Angel Morales 12/2/25 Semiconductor, Mobile Angel Morales 12/2/25 Samsung Reportedly Rejects DRAM Supply Request from Its Own Mobile Experience Division as It Prioritizes Profitability Read More
