Semiconductor, Hardware Angel Morales 12/17/25 Semiconductor, Hardware Angel Morales 12/17/25 NVIDIA and SK hynix Co Develop AI SSD to Transform Inference Performance and NAND Architecture Read More Semiconductor, Hardware Angel Morales 12/15/25 Semiconductor, Hardware Angel Morales 12/15/25 SK Hynix Warns DRAM Supply Tightness Will Persist Through 2028 as AI Demand Reshapes the Memory Market Read More AI, Semiconductor Angel Morales 12/10/25 AI, Semiconductor Angel Morales 12/10/25 NVIDIA Secures Majority of TSMC’s Advanced Packaging Capacity for Years, Creating Tight Supply for Competitors Read More Semiconductor Angel Morales 12/9/25 Semiconductor Angel Morales 12/9/25 TSMC’s Advanced Packaging Capacity Is So Constrained That the Company Is Now Outsourcing Orders to Meet Explosive Demand Read More Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC’s Arizona Fab Sends Engineers to Taiwan for 3nm and 2nm Production Training as Demand for Next Gen Nodes Surges Read More Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC Accelerates Plans to Bring Advanced Packaging to the United States as CoWoS Demand Surges Read More Semiconductor Angel Morales 12/5/25 Semiconductor Angel Morales 12/5/25 Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging Read More Semiconductor, Announcement Angel Morales 12/3/25 Semiconductor, Announcement Angel Morales 12/3/25 Amazon Positions Itself Fully in the ASIC Race With New Trainium3 UltraServers and Next Generation Trainium4 Chips Read More Semiconductor Angel Morales 12/3/25 Semiconductor Angel Morales 12/3/25 After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars Read More Semiconductor Angel Morales 12/2/25 Semiconductor Angel Morales 12/2/25 Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand Read More Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 Intel’s Entry Level Wildcat Lake CPUs to Receive a Refresh With Up to Eight Core Options Read More Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 NVIDIA Feynman GPUs Set to Adopt TSMC A16 One Point Six Nanometer Process Technology Read More Semiconductor, Mobile Angel Morales 12/2/25 Semiconductor, Mobile Angel Morales 12/2/25 Samsung Reportedly Rejects DRAM Supply Request from Its Own Mobile Experience Division as It Prioritizes Profitability Read More Semiconductor, News Angel Morales 12/1/25 Semiconductor, News Angel Morales 12/1/25 NVIDIA CEO Jensen Huang Says TSMC Is Not a “One Man Show” and Operates as an Entire System Read More Semiconductor, Mobile Angel Morales 11/28/25 Semiconductor, Mobile Angel Morales 11/28/25 Samsung Achieves Major Breakthrough With New NAND Flash Technology That Reduces Power Consumption by 96 Percent Read More Semiconductor, Industry, News Angel Morales 11/27/25 Semiconductor, Industry, News Angel Morales 11/27/25 Intel CEO Lip Bu Tan Denies Allegations of IP Transfer Following Hiring of Former TSMC Executive Read More Hardware, Semiconductor Angel Morales 11/27/25 Hardware, Semiconductor Angel Morales 11/27/25 Tachyum Introduces Open Source TDIMM Memory Standard With Major Bandwidth and Capacity Gains for AI Data Centers Read More Semiconductor, News Angel Morales 11/26/25 Semiconductor, News Angel Morales 11/26/25 Samsung Begins Mass Production of 24 Gb GDDR7 Memory; 32 Gbps and 36 Gbps Variants Enter Sampling Read More Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More Semiconductor, Industry Angel Morales 11/26/25 Semiconductor, Industry Angel Morales 11/26/25 TSMC Officially Sues Former Senior Vice President for Joining Intel, Citing Risk of Trade Secret Leakage Read More Newer Posts Older Posts
Semiconductor, Hardware Angel Morales 12/17/25 Semiconductor, Hardware Angel Morales 12/17/25 NVIDIA and SK hynix Co Develop AI SSD to Transform Inference Performance and NAND Architecture Read More
Semiconductor, Hardware Angel Morales 12/15/25 Semiconductor, Hardware Angel Morales 12/15/25 SK Hynix Warns DRAM Supply Tightness Will Persist Through 2028 as AI Demand Reshapes the Memory Market Read More
AI, Semiconductor Angel Morales 12/10/25 AI, Semiconductor Angel Morales 12/10/25 NVIDIA Secures Majority of TSMC’s Advanced Packaging Capacity for Years, Creating Tight Supply for Competitors Read More
Semiconductor Angel Morales 12/9/25 Semiconductor Angel Morales 12/9/25 TSMC’s Advanced Packaging Capacity Is So Constrained That the Company Is Now Outsourcing Orders to Meet Explosive Demand Read More
Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC’s Arizona Fab Sends Engineers to Taiwan for 3nm and 2nm Production Training as Demand for Next Gen Nodes Surges Read More
Semiconductor Angel Morales 12/8/25 Semiconductor Angel Morales 12/8/25 TSMC Accelerates Plans to Bring Advanced Packaging to the United States as CoWoS Demand Surges Read More
Semiconductor Angel Morales 12/5/25 Semiconductor Angel Morales 12/5/25 Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging Read More
Semiconductor, Announcement Angel Morales 12/3/25 Semiconductor, Announcement Angel Morales 12/3/25 Amazon Positions Itself Fully in the ASIC Race With New Trainium3 UltraServers and Next Generation Trainium4 Chips Read More
Semiconductor Angel Morales 12/3/25 Semiconductor Angel Morales 12/3/25 After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars Read More
Semiconductor Angel Morales 12/2/25 Semiconductor Angel Morales 12/2/25 Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand Read More
Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 Intel’s Entry Level Wildcat Lake CPUs to Receive a Refresh With Up to Eight Core Options Read More
Semiconductor, Hardware Angel Morales 12/2/25 Semiconductor, Hardware Angel Morales 12/2/25 NVIDIA Feynman GPUs Set to Adopt TSMC A16 One Point Six Nanometer Process Technology Read More
Semiconductor, Mobile Angel Morales 12/2/25 Semiconductor, Mobile Angel Morales 12/2/25 Samsung Reportedly Rejects DRAM Supply Request from Its Own Mobile Experience Division as It Prioritizes Profitability Read More
Semiconductor, News Angel Morales 12/1/25 Semiconductor, News Angel Morales 12/1/25 NVIDIA CEO Jensen Huang Says TSMC Is Not a “One Man Show” and Operates as an Entire System Read More
Semiconductor, Mobile Angel Morales 11/28/25 Semiconductor, Mobile Angel Morales 11/28/25 Samsung Achieves Major Breakthrough With New NAND Flash Technology That Reduces Power Consumption by 96 Percent Read More
Semiconductor, Industry, News Angel Morales 11/27/25 Semiconductor, Industry, News Angel Morales 11/27/25 Intel CEO Lip Bu Tan Denies Allegations of IP Transfer Following Hiring of Former TSMC Executive Read More
Hardware, Semiconductor Angel Morales 11/27/25 Hardware, Semiconductor Angel Morales 11/27/25 Tachyum Introduces Open Source TDIMM Memory Standard With Major Bandwidth and Capacity Gains for AI Data Centers Read More
Semiconductor, News Angel Morales 11/26/25 Semiconductor, News Angel Morales 11/26/25 Samsung Begins Mass Production of 24 Gb GDDR7 Memory; 32 Gbps and 36 Gbps Variants Enter Sampling Read More
Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More
Semiconductor, Industry Angel Morales 11/26/25 Semiconductor, Industry Angel Morales 11/26/25 TSMC Officially Sues Former Senior Vice President for Joining Intel, Citing Risk of Trade Secret Leakage Read More
