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SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power
Semiconductor, News Angel Morales 3/10/26 Semiconductor, News Angel Morales 3/10/26

SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power

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Samsung and SK hynix Q2 DRAM Quotes Reportedly Spike So Hard That Some Buyers Are Considering Walking Away
Semiconductor, Hardware Angel Morales 3/2/26 Semiconductor, Hardware Angel Morales 3/2/26

Samsung and SK hynix Q2 DRAM Quotes Reportedly Spike So Hard That Some Buyers Are Considering Walking Away

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Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious
Semiconductor Angel Morales 2/24/26 Semiconductor Angel Morales 2/24/26

Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious

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Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum
Hardware, Semiconductor Angel Morales 2/24/26 Hardware, Semiconductor Angel Morales 2/24/26

Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum

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Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26

Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era

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Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply
AI, Hardware, Business Angel Morales 2/10/26 AI, Hardware, Business Angel Morales 2/10/26

Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply

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DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink
Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26

DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink

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SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack
AI, Hardware Angel Morales 1/29/26 AI, Hardware Angel Morales 1/29/26

SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack

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NAND Makers Reportedly Cut Output to Push SSD Prices Higher as DRAM Margins Steal the Spotlight
Hardware Angel Morales 1/21/26 Hardware Angel Morales 1/21/26

NAND Makers Reportedly Cut Output to Push SSD Prices Higher as DRAM Margins Steal the Spotlight

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Samsung and SK hynix Could Face New United States Memory Tariffs
Semiconductor, Hardware Angel Morales 1/19/26 Semiconductor, Hardware Angel Morales 1/19/26

Samsung and SK hynix Could Face New United States Memory Tariffs

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SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab
Semiconductor Angel Morales 1/14/26 Semiconductor Angel Morales 1/14/26

SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab

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SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26

SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026

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“Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast
Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26

“Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast

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Memory Suppliers Are Reportedly Cherry Picking Customers as DRAM Long Term Allocations Concentrate Around Top OEMs
Hardware Angel Morales 1/2/26 Hardware Angel Morales 1/2/26

Memory Suppliers Are Reportedly Cherry Picking Customers as DRAM Long Term Allocations Concentrate Around Top OEMs

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SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever
Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25

SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever

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PC Makers Rush For DRAM LTAs As DDR5 Pricing Pressure Signals 2026 Supply Chain Triage
Hardware Angel Morales 12/29/25 Hardware Angel Morales 12/29/25

PC Makers Rush For DRAM LTAs As DDR5 Pricing Pressure Signals 2026 Supply Chain Triage

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Microsoft And Google Escalate The Memory Supply Fight In South Korea As HBM And LPDDR Allocation Tightens
Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25

Microsoft And Google Escalate The Memory Supply Fight In South Korea As HBM And LPDDR Allocation Tightens

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Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements
Semiconductor Angel Morales 12/22/25 Semiconductor Angel Morales 12/22/25

Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements

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DRAM shortages shift power to Samsung and SK Hynix as customer allocations tighten
Hardware Angel Morales 12/22/25 Hardware Angel Morales 12/22/25

DRAM shortages shift power to Samsung and SK Hynix as customer allocations tighten

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SK hynix Achieves Industry First Certification for 256GB DDR5 RDIMM on Intel Xeon 6
Hardware, Announcement Angel Morales 12/18/25 Hardware, Announcement Angel Morales 12/18/25

SK hynix Achieves Industry First Certification for 256GB DDR5 RDIMM on Intel Xeon 6

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