Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More Semiconductor, Hardware Angel Morales 4/24/26 Semiconductor, Hardware Angel Morales 4/24/26 Google TurboQuant Will Not Solve the AI Memory Crunch as Rising Efficiency Keeps Expanding Overall Demand Read More Semiconductor, AI, Hardware Angel Morales 4/21/26 Semiconductor, AI, Hardware Angel Morales 4/21/26 SK hynix Begins Mass Production of 192GB SOCAMM2 for NVIDIA Vera Rubin and Next Generation AI Data Centers Read More Semiconductor, Hardware Angel Morales 4/10/26 Semiconductor, Hardware Angel Morales 4/10/26 Samsung and SK hynix Shift Toward Long Term DRAM Contracts as Questions Grow Around How Much Higher Prices Can Still Go Read More Semiconductor, News Angel Morales 3/10/26 Semiconductor, News Angel Morales 3/10/26 SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power Read More Semiconductor, Hardware Angel Morales 3/2/26 Semiconductor, Hardware Angel Morales 3/2/26 Samsung and SK hynix Q2 DRAM Quotes Reportedly Spike So Hard That Some Buyers Are Considering Walking Away Read More Semiconductor Angel Morales 2/24/26 Semiconductor Angel Morales 2/24/26 Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious Read More Hardware, Semiconductor Angel Morales 2/24/26 Hardware, Semiconductor Angel Morales 2/24/26 Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum Read More Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More AI, Hardware, Business Angel Morales 2/10/26 AI, Hardware, Business Angel Morales 2/10/26 Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply Read More Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26 DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink Read More AI, Hardware Angel Morales 1/29/26 AI, Hardware Angel Morales 1/29/26 SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack Read More Hardware Angel Morales 1/21/26 Hardware Angel Morales 1/21/26 NAND Makers Reportedly Cut Output to Push SSD Prices Higher as DRAM Margins Steal the Spotlight Read More Semiconductor, Hardware Angel Morales 1/19/26 Semiconductor, Hardware Angel Morales 1/19/26 Samsung and SK hynix Could Face New United States Memory Tariffs Read More Semiconductor Angel Morales 1/14/26 Semiconductor Angel Morales 1/14/26 SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab Read More Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More Hardware Angel Morales 1/2/26 Hardware Angel Morales 1/2/26 Memory Suppliers Are Reportedly Cherry Picking Customers as DRAM Long Term Allocations Concentrate Around Top OEMs Read More Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever Read More Hardware Angel Morales 12/29/25 Hardware Angel Morales 12/29/25 PC Makers Rush For DRAM LTAs As DDR5 Pricing Pressure Signals 2026 Supply Chain Triage Read More Older Posts
Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More
Semiconductor, Hardware Angel Morales 4/24/26 Semiconductor, Hardware Angel Morales 4/24/26 Google TurboQuant Will Not Solve the AI Memory Crunch as Rising Efficiency Keeps Expanding Overall Demand Read More
Semiconductor, AI, Hardware Angel Morales 4/21/26 Semiconductor, AI, Hardware Angel Morales 4/21/26 SK hynix Begins Mass Production of 192GB SOCAMM2 for NVIDIA Vera Rubin and Next Generation AI Data Centers Read More
Semiconductor, Hardware Angel Morales 4/10/26 Semiconductor, Hardware Angel Morales 4/10/26 Samsung and SK hynix Shift Toward Long Term DRAM Contracts as Questions Grow Around How Much Higher Prices Can Still Go Read More
Semiconductor, News Angel Morales 3/10/26 Semiconductor, News Angel Morales 3/10/26 SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power Read More
Semiconductor, Hardware Angel Morales 3/2/26 Semiconductor, Hardware Angel Morales 3/2/26 Samsung and SK hynix Q2 DRAM Quotes Reportedly Spike So Hard That Some Buyers Are Considering Walking Away Read More
Semiconductor Angel Morales 2/24/26 Semiconductor Angel Morales 2/24/26 Report Says Japan Incentives Can Cut Memory Fab Total Cost of Ownership by More Than 50 Percent, But Politics Keep Samsung and SK hynix Cautious Read More
Hardware, Semiconductor Angel Morales 2/24/26 Hardware, Semiconductor Angel Morales 2/24/26 Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum Read More
Semiconductor, AI, Hardware Angel Morales 2/10/26 Semiconductor, AI, Hardware Angel Morales 2/10/26 Micron Faces HBM4 Validation Headwinds, Opening a Clear Lane for Samsung to Regain Share in the Rubin and MI400 Era Read More
AI, Hardware, Business Angel Morales 2/10/26 AI, Hardware, Business Angel Morales 2/10/26 Jensen Huang’s Fried Chicken Diplomacy Highlights How NVIDIA Is Locking Down HBM4 and SOCAMM Supply Read More
Semiconductor, Hardware Angel Morales 2/8/26 Semiconductor, Hardware Angel Morales 2/8/26 DRAM Suppliers Reportedly Move to Post Settlement Contracts, Baking Higher Prices Into New Deals as Agreement Windows Shrink Read More
AI, Hardware Angel Morales 1/29/26 AI, Hardware Angel Morales 1/29/26 SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack Read More
Hardware Angel Morales 1/21/26 Hardware Angel Morales 1/21/26 NAND Makers Reportedly Cut Output to Push SSD Prices Higher as DRAM Margins Steal the Spotlight Read More
Semiconductor, Hardware Angel Morales 1/19/26 Semiconductor, Hardware Angel Morales 1/19/26 Samsung and SK hynix Could Face New United States Memory Tariffs Read More
Semiconductor Angel Morales 1/14/26 Semiconductor Angel Morales 1/14/26 SK hynix Plans Up to 13 Billion Dollars Investment in Advanced Packaging Lines in South Korea Alongside M15X Fab Read More
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More
Hardware Angel Morales 1/2/26 Hardware Angel Morales 1/2/26 Memory Suppliers Are Reportedly Cherry Picking Customers as DRAM Long Term Allocations Concentrate Around Top OEMs Read More
Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever Read More
Hardware Angel Morales 12/29/25 Hardware Angel Morales 12/29/25 PC Makers Rush For DRAM LTAs As DDR5 Pricing Pressure Signals 2026 Supply Chain Triage Read More
