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Intel Could Be Gaining AI Packaging Business as TSMC CoWoS Demand Spills Into Malaysia
Semiconductor, Hardware, AI Angel Morales 8/19/26 Semiconductor, Hardware, AI Angel Morales 8/19/26

Intel Could Be Gaining AI Packaging Business as TSMC CoWoS Demand Spills Into Malaysia

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Intel Puts Nova Lake Desktop First as AMD Introduces Zen 6 Through EPYC Venice
Hardware, Announcement Angel Morales 8/18/26 Hardware, Announcement Angel Morales 8/18/26

Intel Puts Nova Lake Desktop First as AMD Introduces Zen 6 Through EPYC Venice

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Intel CEO Lip Bu Tan Signals New Memory Push as CPU and Memory Stacking Becomes a Strategic Focus
Semiconductor, Hardware Angel Morales 8/14/26 Semiconductor, Hardware Angel Morales 8/14/26

Intel CEO Lip Bu Tan Signals New Memory Push as CPU and Memory Stacking Becomes a Strategic Focus

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Intel Razor Lake AX Appears in HWiNFO as Future Halo Class SoC Takes Shape
Hardware Angel Morales 8/13/26 Hardware Angel Morales 8/13/26

Intel Razor Lake AX Appears in HWiNFO as Future Halo Class SoC Takes Shape

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Intel Fab 38 Shows Signs of Renewed Activity as Israel Expansion Returns to Focus
Semiconductor, Industry Angel Morales 8/12/26 Semiconductor, Industry Angel Morales 8/12/26

Intel Fab 38 Shows Signs of Renewed Activity as Israel Expansion Returns to Focus

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Intel Diamond Rapids Xeon 7 Reportedly Targets 256 P Cores to Match AMD EPYC Venice
Semiconductor, Hardware Angel Morales 8/10/26 Semiconductor, Hardware Angel Morales 8/10/26

Intel Diamond Rapids Xeon 7 Reportedly Targets 256 P Cores to Match AMD EPYC Venice

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Intel Nova Lake 16 Core Desktop CPU Reportedly Reaches 154W PL2 as 12 Xe3P iGPU Gets 40W
Semiconductor, Hardware Angel Morales 8/10/26 Semiconductor, Hardware Angel Morales 8/10/26

Intel Nova Lake 16 Core Desktop CPU Reportedly Reaches 154W PL2 as 12 Xe3P iGPU Gets 40W

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Intel Diamond Rapids Xeon 7 Sample Appears With 32 Cores and 240 MB L3 Cache
AI, Semiconductor, Hardware Angel Morales 8/7/26 AI, Semiconductor, Hardware Angel Morales 8/7/26

Intel Diamond Rapids Xeon 7 Sample Appears With 32 Cores and 240 MB L3 Cache

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Intel Reportedly Adds Overtime Bonuses at Ohio One as EMIB T Nears 2027 Production
Semiconductor Angel Morales 8/4/26 Semiconductor Angel Morales 8/4/26

Intel Reportedly Adds Overtime Bonuses at Ohio One as EMIB T Nears 2027 Production

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TSMC Reportedly Develops EMIB Like Packaging as CoWoS Capacity Tightens
Semiconductor, AI Angel Morales 7/31/26 Semiconductor, AI Angel Morales 7/31/26

TSMC Reportedly Develops EMIB Like Packaging as CoWoS Capacity Tightens

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Intel’s Premium Xeon Strategy Pays Off as Server CPU Prices Rise 48% in Q2
Semiconductor, Industry Angel Morales 7/28/26 Semiconductor, Industry Angel Morales 7/28/26

Intel’s Premium Xeon Strategy Pays Off as Server CPU Prices Rise 48% in Q2

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Intel and AMD Reportedly Lock In Year Long CPU Deals With Chinese AI Data Centers
AI, Hardware Angel Morales 7/24/26 AI, Hardware Angel Morales 7/24/26

Intel and AMD Reportedly Lock In Year Long CPU Deals With Chinese AI Data Centers

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SK hynix Denies Intel Ohio Fab Acquisition While Keeping Investment Options Open
Semiconductor, Hardware, Industry Angel Morales 7/23/26 Semiconductor, Hardware, Industry Angel Morales 7/23/26

SK hynix Denies Intel Ohio Fab Acquisition While Keeping Investment Options Open

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Intel Xeon 6 Gains 8000 MT/s RDIMM Support as Gen 2 MRDIMM Arrives in 2027
Hardware, Announcement Angel Morales 7/21/26 Hardware, Announcement Angel Morales 7/21/26

Intel Xeon 6 Gains 8000 MT/s RDIMM Support as Gen 2 MRDIMM Arrives in 2027

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ITRI Removes Wei Jen Lo From Website as TSMC Intel Trade Secret Case Deepens
Semiconductor, Industry Angel Morales 7/16/26 Semiconductor, Industry Angel Morales 7/16/26

ITRI Removes Wei Jen Lo From Website as TSMC Intel Trade Secret Case Deepens

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China’s Helium Export Ban Revives Intel CEO Lip Bu Tan’s Warning Over AI Chip Supply
Semiconductor, Hardware Angel Morales 7/13/26 Semiconductor, Hardware Angel Morales 7/13/26

China’s Helium Export Ban Revives Intel CEO Lip Bu Tan’s Warning Over AI Chip Supply

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Intel EMIB T Pushes AI Packaging Beyond 10 Reticle Dies With 12 Gb/s HBM4e Support
Semiconductor Angel Morales 7/13/26 Semiconductor Angel Morales 7/13/26

Intel EMIB T Pushes AI Packaging Beyond 10 Reticle Dies With 12 Gb/s HBM4e Support

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Intel XBM Memory Targets HBM With 32 GT/s UCIe Links and Lower Packaging Cost
Semiconductor Angel Morales 7/9/26 Semiconductor Angel Morales 7/9/26

Intel XBM Memory Targets HBM With 32 GT/s UCIe Links and Lower Packaging Cost

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TSMC and Intel Accelerate Glass Packaging Race as Market Targets $8.1 Billion
Semiconductor Angel Morales 6/25/26 Semiconductor Angel Morales 6/25/26

TSMC and Intel Accelerate Glass Packaging Race as Market Targets $8.1 Billion

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Intel CEO Lip Bu Tan Praises Elon Musk as Memory and Helium Threaten AI Chip Supply
Semiconductor, Hardware Angel Morales 6/22/26 Semiconductor, Hardware Angel Morales 6/22/26

Intel CEO Lip Bu Tan Praises Elon Musk as Memory and Helium Threaten AI Chip Supply

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