Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More Semiconductor Angel Morales 1/6/26 Semiconductor Angel Morales 1/6/26 TSMC 2nm Ramp Accelerates, With Peak Monthly Output Targeting 140,000 Wafers by End of 2026 Read More Semiconductor Angel Morales 1/6/26 Semiconductor Angel Morales 1/6/26 No One Can Escape Memory Shortages Says Samsung Co CEO TM Roh as Price Pressure Spreads From Phones to TVs and Appliances Read More Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 NVIDIA CEO Jensen Huang Reportedly Set to Sign Taiwan Constellation HQ Construction Ceremony This Month Read More Semiconductor Angel Morales 1/5/26 Semiconductor Angel Morales 1/5/26 TSMC US Fabs Drive Up Operating Costs, But the Strategic Value Goes Far Beyond Near Term Margins Read More Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More Semiconductor Angel Morales 1/2/26 Semiconductor Angel Morales 1/2/26 TSMC Supply Constraints Are Forcing Fabless Chipmakers to Diversify, With Samsung Foundry Emerging as a Key Alternative Read More Semiconductor Angel Morales 12/31/25 Semiconductor Angel Morales 12/31/25 Samsung DS Staff Reportedly Set for 43% to 48% Performance Bonuses in Early 2026 as DRAM and HBM Momentum Lifts Results Read More Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 TSMC Reportedly Pulls Forward Arizona 3nm To 2027 As Intel And Samsung Close The Gap On Leading Edge Momentum Read More Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever Read More Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 Samsung Reportedly Pivots Taylor Texas Fab From 4nm To 2nm GAA, Raising Initial Output Targets To Challenge TSMC Read More Semiconductor Angel Morales 12/29/25 Semiconductor Angel Morales 12/29/25 TSMC Says Hsinchu Sites Triggered Evacuation Protocols After 7.0 Quake, With Safety Systems Operating Normally Read More Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 TSMC Ramps Capacity Expansion As AI Demand Pushes 2nm 3nm And CoWoS Into A Supply Bottleneck Read More Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 Microsoft And Google Escalate The Memory Supply Fight In South Korea As HBM And LPDDR Allocation Tightens Read More Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 Intel Foundry Keeps 14A as the Main Target for External Clients While 18A Stays on the Menu as a Secondary Option Read More Semiconductor, Hardware Angel Morales 12/26/25 Semiconductor, Hardware Angel Morales 12/26/25 Samsung to Keep DDR4 Lines Running Longer, But Supply Is Being Reserved for Servers, Not PC Gamers Read More Semiconductor Angel Morales 12/24/25 Semiconductor Angel Morales 12/24/25 Former Samsung Executives and Employees Charged Over Alleged 10nm DRAM Trade Secret Leak to China’s CXMT Read More Semiconductor Angel Morales 12/23/25 Semiconductor Angel Morales 12/23/25 NVIDIA, AMD, and Qualcomm May Hesitate to Use Intel Foundry If Their “Secret Sauce” Risks Exposure Read More Semiconductor Angel Morales 12/23/25 Semiconductor Angel Morales 12/23/25 TSMC Reportedly Eyes 2nm Upgrade for Kumamoto Fab 2 to Stay Competitive When It Comes Online Read More Semiconductor Angel Morales 12/22/25 Semiconductor Angel Morales 12/22/25 Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements Read More Newer Posts Older Posts
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
Semiconductor Angel Morales 1/6/26 Semiconductor Angel Morales 1/6/26 TSMC 2nm Ramp Accelerates, With Peak Monthly Output Targeting 140,000 Wafers by End of 2026 Read More
Semiconductor Angel Morales 1/6/26 Semiconductor Angel Morales 1/6/26 No One Can Escape Memory Shortages Says Samsung Co CEO TM Roh as Price Pressure Spreads From Phones to TVs and Appliances Read More
Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 NVIDIA CEO Jensen Huang Reportedly Set to Sign Taiwan Constellation HQ Construction Ceremony This Month Read More
Semiconductor Angel Morales 1/5/26 Semiconductor Angel Morales 1/5/26 TSMC US Fabs Drive Up Operating Costs, But the Strategic Value Goes Far Beyond Near Term Margins Read More
Semiconductor, Hardware Angel Morales 1/5/26 Semiconductor, Hardware Angel Morales 1/5/26 “Samsung is Back in the HBM Race”, Says Co CEO as HBM4 Momentum Builds and 2027 Share Flip Is Forecast Read More
Semiconductor Angel Morales 1/2/26 Semiconductor Angel Morales 1/2/26 TSMC Supply Constraints Are Forcing Fabless Chipmakers to Diversify, With Samsung Foundry Emerging as a Key Alternative Read More
Semiconductor Angel Morales 12/31/25 Semiconductor Angel Morales 12/31/25 Samsung DS Staff Reportedly Set for 43% to 48% Performance Bonuses in Early 2026 as DRAM and HBM Momentum Lifts Results Read More
Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 TSMC Reportedly Pulls Forward Arizona 3nm To 2027 As Intel And Samsung Close The Gap On Leading Edge Momentum Read More
Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 SK hynix Reportedly Targets 2.5D Advanced Packaging Production In The United States, Eyeing Indiana As A New HBM Scale Lever Read More
Semiconductor Angel Morales 12/30/25 Semiconductor Angel Morales 12/30/25 Samsung Reportedly Pivots Taylor Texas Fab From 4nm To 2nm GAA, Raising Initial Output Targets To Challenge TSMC Read More
Semiconductor Angel Morales 12/29/25 Semiconductor Angel Morales 12/29/25 TSMC Says Hsinchu Sites Triggered Evacuation Protocols After 7.0 Quake, With Safety Systems Operating Normally Read More
Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 TSMC Ramps Capacity Expansion As AI Demand Pushes 2nm 3nm And CoWoS Into A Supply Bottleneck Read More
Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 Microsoft And Google Escalate The Memory Supply Fight In South Korea As HBM And LPDDR Allocation Tightens Read More
Semiconductor Angel Morales 12/26/25 Semiconductor Angel Morales 12/26/25 Intel Foundry Keeps 14A as the Main Target for External Clients While 18A Stays on the Menu as a Secondary Option Read More
Semiconductor, Hardware Angel Morales 12/26/25 Semiconductor, Hardware Angel Morales 12/26/25 Samsung to Keep DDR4 Lines Running Longer, But Supply Is Being Reserved for Servers, Not PC Gamers Read More
Semiconductor Angel Morales 12/24/25 Semiconductor Angel Morales 12/24/25 Former Samsung Executives and Employees Charged Over Alleged 10nm DRAM Trade Secret Leak to China’s CXMT Read More
Semiconductor Angel Morales 12/23/25 Semiconductor Angel Morales 12/23/25 NVIDIA, AMD, and Qualcomm May Hesitate to Use Intel Foundry If Their “Secret Sauce” Risks Exposure Read More
Semiconductor Angel Morales 12/23/25 Semiconductor Angel Morales 12/23/25 TSMC Reportedly Eyes 2nm Upgrade for Kumamoto Fab 2 to Stay Competitive When It Comes Online Read More
Semiconductor Angel Morales 12/22/25 Semiconductor Angel Morales 12/22/25 Samsung’s HBM Turnaround Pulls AMD and NVIDIA Back to the Table After Internal Process Improvements Read More
