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SK hynix Reportedly Evaluates Intel EMIB as CoWoS Capacity Tightens the AI Packaging Market
Semiconductor Angel Morales 5/12/26 Semiconductor Angel Morales 5/12/26

SK hynix Reportedly Evaluates Intel EMIB as CoWoS Capacity Tightens the AI Packaging Market

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SK hynix Faces Wave of Customer Cash Offers as AI Memory Demand Leaves Available Capacity Near Zero
Semiconductor Angel Morales 5/10/26 Semiconductor Angel Morales 5/10/26

SK hynix Faces Wave of Customer Cash Offers as AI Memory Demand Leaves Available Capacity Near Zero

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Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership
Semiconductor Angel Morales 5/9/26 Semiconductor Angel Morales 5/9/26

Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership

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Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul
Semiconductor, Hardware Angel Morales 5/4/26 Semiconductor, Hardware Angel Morales 5/4/26

Memory Prices May Not Fall Even as Supply Pressure Eases, Korean Research Note Warns Hyperscalers Are Locking In for the Long Haul

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Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger
Semiconductor Angel Morales 5/4/26 Semiconductor Angel Morales 5/4/26

Samsung Officially Discontinues LPDDR4 and LPDDR4X as Chip Profits Surge and 2027 Memory Shortages Loom Larger

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3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory
Semiconductor, Hardware Angel Morales 4/27/26 Semiconductor, Hardware Angel Morales 4/27/26

3D X DRAM Moves Closer to Reality as a High Density HBM Alternative for AI Memory

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DeepSeek V4 Targets the AI Memory Shortage With Lower KV Cache Demands, But Performance Tradeoffs Remain a Key Question
AI Angel Morales 4/27/26 AI Angel Morales 4/27/26

DeepSeek V4 Targets the AI Memory Shortage With Lower KV Cache Demands, But Performance Tradeoffs Remain a Key Question

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Intel’s ZAM Memory Gets Major Support From Japan as a Potential Low Power HBM Alternative
Semiconductor Angel Morales 4/27/26 Semiconductor Angel Morales 4/27/26

Intel’s ZAM Memory Gets Major Support From Japan as a Potential Low Power HBM Alternative

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OpenAI Targets 30GW of AI Compute by 2030, Setting a Far Bigger Infrastructure Ambition Than Its Rivals
AI, Industry Angel Morales 4/23/26 AI, Industry Angel Morales 4/23/26

OpenAI Targets 30GW of AI Compute by 2030, Setting a Far Bigger Infrastructure Ambition Than Its Rivals

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OpenAI Patent Outlines AI Chip Design With Up to 20 HBM Stacks, Pointing to a Bigger Packaging Play Beyond Today’s Limits
AI, Hardware Angel Morales 4/23/26 AI, Hardware Angel Morales 4/23/26

OpenAI Patent Outlines AI Chip Design With Up to 20 HBM Stacks, Pointing to a Bigger Packaging Play Beyond Today’s Limits

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Samsung’s Memory Surge Is Becoming One of the Defining Profit Stories of the AI Race
Semiconductor, AI, Hardware Angel Morales 4/13/26 Semiconductor, AI, Hardware Angel Morales 4/13/26

Samsung’s Memory Surge Is Becoming One of the Defining Profit Stories of the AI Race

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Micron Reportedly Eyes Stacked GDDR Memory for AI, a Move That Could Put Even More Pressure on Gaming GPU Supply
AI, Hardware, Semiconductor Angel Morales 3/31/26 AI, Hardware, Semiconductor Angel Morales 3/31/26

Micron Reportedly Eyes Stacked GDDR Memory for AI, a Move That Could Put Even More Pressure on Gaming GPU Supply

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Big Tech Is Locking In Memory for Years, and That Could Keep the Shortage Alive Much Longer Than Expected
Semiconductor, News Angel Morales 3/23/26 Semiconductor, News Angel Morales 3/23/26

Big Tech Is Locking In Memory for Years, and That Could Keep the Shortage Alive Much Longer Than Expected

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NVIDIA Feynman Roadmap Points to 3D Stacked Design, Custom HBM and a New Rosa CPU for 2028
AI, Hardware, GTC 2026 Angel Morales 3/17/26 AI, Hardware, GTC 2026 Angel Morales 3/17/26

NVIDIA Feynman Roadmap Points to 3D Stacked Design, Custom HBM and a New Rosa CPU for 2028

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AMD’s Lisa Su Reportedly Heads to South Korea to Lock In AI Memory Supply as Competition Tightens
Hardware, Report Angel Morales 3/12/26 Hardware, Report Angel Morales 3/12/26

AMD’s Lisa Su Reportedly Heads to South Korea to Lock In AI Memory Supply as Competition Tightens

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Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum
Hardware, Semiconductor Angel Morales 2/24/26 Hardware, Semiconductor Angel Morales 2/24/26

Samsung Reclaims DRAM Crown, Omdia Puts Market Share Back Ahead of SK hynix on HBM Momentum

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Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits
Semiconductor Angel Morales 2/12/26 Semiconductor Angel Morales 2/12/26

Intel and Partners Showcase Z Angle Memory Prototype as a Potential Path Beyond HBM Thermal Limits

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SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack
AI, Hardware Angel Morales 1/29/26 AI, Hardware Angel Morales 1/29/26

SK hynix Plans U.S. Based AI Solutions Arm Called AI Company to Expand Beyond Memory Into the AI Data Center Stack

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Suppliers Report Smooth Vera Rubin Ramp So Far as NVIDIA Reuses Key Blackwell Elements
AI, Hardware Angel Morales 1/20/26 AI, Hardware Angel Morales 1/20/26

Suppliers Report Smooth Vera Rubin Ramp So Far as NVIDIA Reuses Key Blackwell Elements

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Samsung DRAM Output Growth Looks Capped at 5% in 2026, Setting Up a Longer Consumer Memory Squeeze
Hardware Angel Morales 1/19/26 Hardware Angel Morales 1/19/26

Samsung DRAM Output Growth Looks Capped at 5% in 2026, Setting Up a Longer Consumer Memory Squeeze

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