Intel’s EMIB Gains Momentum as a Potential Alternative to TSMC CoWoS in the AI Packaging Race

Angel Morales 3/9/26 Angel Morales 3/9/26

Intel’s EMIB Gains Momentum as a Potential Alternative to TSMC CoWoS in the AI Packaging Race

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Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging

Angel Morales 1/23/26 Angel Morales 1/23/26

Intel Showcases First Glass Core Substrate Integrated with EMIB Packaging

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Intel Positions EMIB As A Stronger Alternative To Traditional 2.5D Packaging

Angel Morales 1/16/26 Angel Morales 1/16/26

Intel Positions EMIB As A Stronger Alternative To Traditional 2.5D Packaging

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Apple’s Server Chip May Rely on Intel EMIB Packaging as TSMC CoWoS Capacity Tightens

Angel Morales 12/19/25 Angel Morales 12/19/25

Apple’s Server Chip May Rely on Intel EMIB Packaging as TSMC CoWoS Capacity Tightens

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Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging

Angel Morales 12/5/25 Angel Morales 12/5/25

Intel VP Rejects Foundry Spin Off Concerns as Strong Interest Builds Around 18A Chips and Advanced Packaging

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Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand

Angel Morales 12/2/25 Angel Morales 12/2/25

Intel Plans to Produce EMIB Packaging in South Korea to Meet Surging AI Demand

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