Semiconductor, Business Angel Morales 10/4/26 Semiconductor, Business Angel Morales 10/4/26 Micron Says Physical AI Could Keep Memory Demand Tight Through 2028 Read More AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More Semiconductor Angel Morales 9/22/26 Semiconductor Angel Morales 9/22/26 Samsung HBM4 Output Could at Least Double in 2027 as AI Demand Accelerates Read More Semiconductor, Hardware Angel Morales 9/8/26 Semiconductor, Hardware Angel Morales 9/8/26 Samsung 4 nm Lines Reach Full Utilization as HBM4 Takes Up to 60% of Capacity Read More Semiconductor, Hardware Angel Morales 9/2/26 Semiconductor, Hardware Angel Morales 9/2/26 AMD Says Hybrid Bonded 3D DRAM Could Be 17x More Energy Efficient Than HBM Read More AI, Semiconductor, Hardware Angel Morales 9/1/26 AI, Semiconductor, Hardware Angel Morales 9/1/26 NVIDIA NVHBM Could Reshape HBM Economics as Base Die Costs Rise Read More AI, Hardware Angel Morales 8/27/26 AI, Hardware Angel Morales 8/27/26 NVIDIA Unveils NVHBM With 30% More Bandwidth and Lower Power Than HBM4E Read More Semiconductor, AI, Hardware Angel Morales 8/24/26 Semiconductor, AI, Hardware Angel Morales 8/24/26 Micron Warns AI Memory Wall Is Widening as Compute Outpaces DRAM Bandwidth Read More Semiconductor, Hardware, AI Angel Morales 8/17/26 Semiconductor, Hardware, AI Angel Morales 8/17/26 SanDisk HBF Comparison Faces Questions Over HBM Bandwidth, BF16 and NAND Endurance Read More AI, Hardware, Semiconductor Angel Morales 8/17/26 AI, Hardware, Semiconductor Angel Morales 8/17/26 Samsung Reportedly Prepares 2 nm HBM Base Die Production as AI Memory Roadmap Accelerates Read More AI, Hardware Angel Morales 8/12/26 AI, Hardware Angel Morales 8/12/26 NVIDIA Kyber Rack Could Carry 340.4 TB of DRAM and Cost $41.6 Million Read More AI, Semiconductor, Hardware Angel Morales 8/11/26 AI, Semiconductor, Hardware Angel Morales 8/11/26 Samsung HBM4 Yield Reportedly Reaches 80% as AI Memory Production Accelerates Read More AI, Hardware, Semiconductor Angel Morales 8/11/26 AI, Hardware, Semiconductor Angel Morales 8/11/26 NVIDIA Vera Rubin Packs 74.7 TB of DRAM as AI Memory Costs Surge Read More AI, Hardware, Semiconductor Angel Morales 8/6/26 AI, Hardware, Semiconductor Angel Morales 8/6/26 HBF Could Store AI Model Weights While HBM Handles Dynamic KV Cache Read More AI, Semiconductor, Hardware Angel Morales 8/5/26 AI, Semiconductor, Hardware Angel Morales 8/5/26 SK hynix and Sandisk Unveil HBF Standard With Up to 3 TB/s Bandwidth Read More AI, Hardware Angel Morales 6/24/26 AI, Hardware Angel Morales 6/24/26 Micron Deploys Claude and Backs Anthropic as AI Memory Demand Accelerates Read More AI, Hardware, Semiconductor Angel Morales 6/18/26 AI, Hardware, Semiconductor Angel Morales 6/18/26 SK hynix Samples 48 GB HBM4E At 16 Gbps As AI Memory Race Accelerates Read More Semiconductor Angel Morales 6/18/26 Semiconductor Angel Morales 6/18/26 Samsung Targets Late 2027 For 1d DRAM Mass Production As HBM5 AI Memory Race Accelerates Read More Semiconductor Angel Morales 5/9/26 Semiconductor Angel Morales 5/9/26 Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership Read More Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More Older Posts
Semiconductor, Business Angel Morales 10/4/26 Semiconductor, Business Angel Morales 10/4/26 Micron Says Physical AI Could Keep Memory Demand Tight Through 2028 Read More
AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More
Semiconductor Angel Morales 9/22/26 Semiconductor Angel Morales 9/22/26 Samsung HBM4 Output Could at Least Double in 2027 as AI Demand Accelerates Read More
Semiconductor, Hardware Angel Morales 9/8/26 Semiconductor, Hardware Angel Morales 9/8/26 Samsung 4 nm Lines Reach Full Utilization as HBM4 Takes Up to 60% of Capacity Read More
Semiconductor, Hardware Angel Morales 9/2/26 Semiconductor, Hardware Angel Morales 9/2/26 AMD Says Hybrid Bonded 3D DRAM Could Be 17x More Energy Efficient Than HBM Read More
AI, Semiconductor, Hardware Angel Morales 9/1/26 AI, Semiconductor, Hardware Angel Morales 9/1/26 NVIDIA NVHBM Could Reshape HBM Economics as Base Die Costs Rise Read More
AI, Hardware Angel Morales 8/27/26 AI, Hardware Angel Morales 8/27/26 NVIDIA Unveils NVHBM With 30% More Bandwidth and Lower Power Than HBM4E Read More
Semiconductor, AI, Hardware Angel Morales 8/24/26 Semiconductor, AI, Hardware Angel Morales 8/24/26 Micron Warns AI Memory Wall Is Widening as Compute Outpaces DRAM Bandwidth Read More
Semiconductor, Hardware, AI Angel Morales 8/17/26 Semiconductor, Hardware, AI Angel Morales 8/17/26 SanDisk HBF Comparison Faces Questions Over HBM Bandwidth, BF16 and NAND Endurance Read More
AI, Hardware, Semiconductor Angel Morales 8/17/26 AI, Hardware, Semiconductor Angel Morales 8/17/26 Samsung Reportedly Prepares 2 nm HBM Base Die Production as AI Memory Roadmap Accelerates Read More
AI, Hardware Angel Morales 8/12/26 AI, Hardware Angel Morales 8/12/26 NVIDIA Kyber Rack Could Carry 340.4 TB of DRAM and Cost $41.6 Million Read More
AI, Semiconductor, Hardware Angel Morales 8/11/26 AI, Semiconductor, Hardware Angel Morales 8/11/26 Samsung HBM4 Yield Reportedly Reaches 80% as AI Memory Production Accelerates Read More
AI, Hardware, Semiconductor Angel Morales 8/11/26 AI, Hardware, Semiconductor Angel Morales 8/11/26 NVIDIA Vera Rubin Packs 74.7 TB of DRAM as AI Memory Costs Surge Read More
AI, Hardware, Semiconductor Angel Morales 8/6/26 AI, Hardware, Semiconductor Angel Morales 8/6/26 HBF Could Store AI Model Weights While HBM Handles Dynamic KV Cache Read More
AI, Semiconductor, Hardware Angel Morales 8/5/26 AI, Semiconductor, Hardware Angel Morales 8/5/26 SK hynix and Sandisk Unveil HBF Standard With Up to 3 TB/s Bandwidth Read More
AI, Hardware Angel Morales 6/24/26 AI, Hardware Angel Morales 6/24/26 Micron Deploys Claude and Backs Anthropic as AI Memory Demand Accelerates Read More
AI, Hardware, Semiconductor Angel Morales 6/18/26 AI, Hardware, Semiconductor Angel Morales 6/18/26 SK hynix Samples 48 GB HBM4E At 16 Gbps As AI Memory Race Accelerates Read More
Semiconductor Angel Morales 6/18/26 Semiconductor Angel Morales 6/18/26 Samsung Targets Late 2027 For 1d DRAM Mass Production As HBM5 AI Memory Race Accelerates Read More
Semiconductor Angel Morales 5/9/26 Semiconductor Angel Morales 5/9/26 Samsung Explores a NAND Style Route for Future DRAM While SK hynix Pushes 4F² Vertical Gate Design in the Race for AI Memory Leadership Read More
Semiconductor Angel Morales 4/29/26 Semiconductor Angel Morales 4/29/26 SK hynix Verifies 12 Die Hybrid Bonded HBM Stack As HBM4 Packaging Race Accelerates, But Yield Remains Undisclosed Read More
