Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 Rambus Quietly Builds a Core Piece of the AI Server Memory Shift as SOCAMM2 Gains Momentum Read More Hardware, Announcement Angel Morales 4/24/26 Hardware, Announcement Angel Morales 4/24/26 JEDEC Previews LPDDR6 With SOCAMM2, PIM, and 512 GB Density Goals for Next Generation AI Servers Read More Semiconductor, AI, Hardware Angel Morales 4/21/26 Semiconductor, AI, Hardware Angel Morales 4/21/26 SK hynix Begins Mass Production of 192GB SOCAMM2 for NVIDIA Vera Rubin and Next Generation AI Data Centers Read More Semiconductor, AI, Hardware Angel Morales 4/17/26 Semiconductor, AI, Hardware Angel Morales 4/17/26 AMD Confirms EPYC Verano Will Bring LPDDR5X SOCAMM2 Memory to AI Rack Scale Systems in 2027 Read More Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Micron Starts High Volume Production of HBM4, PCIe Gen6 SSDs and SOCAMM2 for NVIDIA Vera Rubin Read More AI, Hardware Angel Morales 3/4/26 AI, Hardware Angel Morales 3/4/26 Micron Ships the World’s First 256GB SOCAMM2 Modules Targeted Toward the Agentic AI Frenzy Read More Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
Semiconductor, AI, Hardware Angel Morales 4/24/26 Semiconductor, AI, Hardware Angel Morales 4/24/26 Rambus Quietly Builds a Core Piece of the AI Server Memory Shift as SOCAMM2 Gains Momentum Read More
Hardware, Announcement Angel Morales 4/24/26 Hardware, Announcement Angel Morales 4/24/26 JEDEC Previews LPDDR6 With SOCAMM2, PIM, and 512 GB Density Goals for Next Generation AI Servers Read More
Semiconductor, AI, Hardware Angel Morales 4/21/26 Semiconductor, AI, Hardware Angel Morales 4/21/26 SK hynix Begins Mass Production of 192GB SOCAMM2 for NVIDIA Vera Rubin and Next Generation AI Data Centers Read More
Semiconductor, AI, Hardware Angel Morales 4/17/26 Semiconductor, AI, Hardware Angel Morales 4/17/26 AMD Confirms EPYC Verano Will Bring LPDDR5X SOCAMM2 Memory to AI Rack Scale Systems in 2027 Read More
Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Semiconductor, Hardware, GTC 2026 Angel Morales 3/17/26 Micron Starts High Volume Production of HBM4, PCIe Gen6 SSDs and SOCAMM2 for NVIDIA Vera Rubin Read More
AI, Hardware Angel Morales 3/4/26 AI, Hardware Angel Morales 3/4/26 Micron Ships the World’s First 256GB SOCAMM2 Modules Targeted Toward the Agentic AI Frenzy Read More
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
