AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More AI, Semiconductor, Hardware Angel Morales 8/3/26 AI, Semiconductor, Hardware Angel Morales 8/3/26 CXMT LPDDR6 Reaches 12.8 Gbps as Mass Production Moves Closer Read More AI, Hardware Angel Morales 6/16/26 AI, Hardware Angel Morales 6/16/26 LPDDR6 Targets 512GB Modules As AI Datacenters Chase More Efficient Memory Read More Semiconductor, Hardware Angel Morales 5/12/26 Semiconductor, Hardware Angel Morales 5/12/26 Intel Reportedly Brings On Package Memory Back With Razor Lake AX to Challenge AMD’s Future Halo Class APUs Read More Hardware, Announcement Angel Morales 4/24/26 Hardware, Announcement Angel Morales 4/24/26 JEDEC Previews LPDDR6 With SOCAMM2, PIM, and 512 GB Density Goals for Next Generation AI Servers Read More Semiconductor, News Angel Morales 3/10/26 Semiconductor, News Angel Morales 3/10/26 SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power Read More Semiconductor Angel Morales 1/13/26 Semiconductor Angel Morales 1/13/26 Innosilicon LPDDR6 and LPDDR5X Memory Controller IP Delivered To First Customers, Targeting Up To 14.4 Gbps Read More Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More Hardware Angel Morales 7/10/25 Hardware Angel Morales 7/10/25 JEDEC Introduces LPDDR6 Standard for Mobile and AI Systems, Promising Major Gains in Performance, Efficiency, and Security Read More News Angel Morales 12/4/24 News Angel Morales 12/4/24 Samsung and SK Hynix Collaborate to Standardize LPDDR6-PIM Memory for Enhanced Efficiency Read More
AI, Semiconductor, Hardware Angel Morales 9/23/26 AI, Semiconductor, Hardware Angel Morales 9/23/26 SK hynix Says AI Cannot Exist Without Memory as Next Generation Production Expands Read More
AI, Semiconductor, Hardware Angel Morales 8/3/26 AI, Semiconductor, Hardware Angel Morales 8/3/26 CXMT LPDDR6 Reaches 12.8 Gbps as Mass Production Moves Closer Read More
AI, Hardware Angel Morales 6/16/26 AI, Hardware Angel Morales 6/16/26 LPDDR6 Targets 512GB Modules As AI Datacenters Chase More Efficient Memory Read More
Semiconductor, Hardware Angel Morales 5/12/26 Semiconductor, Hardware Angel Morales 5/12/26 Intel Reportedly Brings On Package Memory Back With Razor Lake AX to Challenge AMD’s Future Halo Class APUs Read More
Hardware, Announcement Angel Morales 4/24/26 Hardware, Announcement Angel Morales 4/24/26 JEDEC Previews LPDDR6 With SOCAMM2, PIM, and 512 GB Density Goals for Next Generation AI Servers Read More
Semiconductor, News Angel Morales 3/10/26 Semiconductor, News Angel Morales 3/10/26 SK hynix Unveils 1c LPDDR6 With 16Gb Density, 10.7 Gbps Speeds, and More Than 20% Lower Power Read More
Semiconductor Angel Morales 1/13/26 Semiconductor Angel Morales 1/13/26 Innosilicon LPDDR6 and LPDDR5X Memory Controller IP Delivered To First Customers, Targeting Up To 14.4 Gbps Read More
Semiconductor, CES 2026 Angel Morales 1/7/26 Semiconductor, CES 2026 Angel Morales 1/7/26 SK hynix Showcases 48GB 16 Layer HBM4, LPDDR6, SOCAMM2, And 321 Layer 2Tb QLC NAND To Power Next Gen AI Platforms At CES 2026 Read More
Semiconductor Angel Morales 11/26/25 Semiconductor Angel Morales 11/26/25 Next ISSCC Conference Scheduled for February 2026 Read More
Hardware Angel Morales 7/10/25 Hardware Angel Morales 7/10/25 JEDEC Introduces LPDDR6 Standard for Mobile and AI Systems, Promising Major Gains in Performance, Efficiency, and Security Read More
News Angel Morales 12/4/24 News Angel Morales 12/4/24 Samsung and SK Hynix Collaborate to Standardize LPDDR6-PIM Memory for Enhanced Efficiency Read More
