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China EUV Prototype Reportedly Operational and Could Tape Out Chips by 2030 Using Legacy ASML Components
Semiconductor Angel Morales 12/18/25 Semiconductor Angel Morales 12/18/25

China EUV Prototype Reportedly Operational and Could Tape Out Chips by 2030 Using Legacy ASML Components

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After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars
Semiconductor Angel Morales 12/3/25 Semiconductor Angel Morales 12/3/25

After Leaving Intel, Pat Gelsinger Secures United States Government Support as xLight Receives 150 Million Dollars

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TSMC’s A14 Facility in Taiwan Becomes Its Most Expensive Project Yet, Bringing 1.4nm Chips by 2028
Semiconductor, Industry Angel Morales 11/7/25 Semiconductor, Industry Angel Morales 11/7/25

TSMC’s A14 Facility in Taiwan Becomes Its Most Expensive Project Yet, Bringing 1.4nm Chips by 2028

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ASML Expects Samsung’s Foundry Business to Fully Recover When the Taylor Plant Begins Operations Next Year
Semiconductor Angel Morales 11/4/25 Semiconductor Angel Morales 11/4/25

ASML Expects Samsung’s Foundry Business to Fully Recover When the Taylor Plant Begins Operations Next Year

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