Semiconductor, Hardware Angel Morales 5/12/26 Semiconductor, Hardware Angel Morales 5/12/26 Intel Reportedly Brings On Package Memory Back With Razor Lake AX to Challenge AMD’s Future Halo Class APUs Read More Mobile, Semiconductor, Hardware Angel Morales 4/8/26 Mobile, Semiconductor, Hardware Angel Morales 4/8/26 MediaTek Dimensity 9600 Pro Rumored To Push Smartphone Performance Toward Desktop Territory Read More Hardware Angel Morales 4/7/26 Hardware Angel Morales 4/7/26 Intel Quietly Adds Core Ultra 7 251HX to Arrow Lake HX Lineup With 18 Cores, 5.1 GHz Boost, and 3 Xe Cores Read More Mobile Angel Morales 1/20/25 Mobile Angel Morales 1/20/25 Snapdragon 8 Elite Gains a 7-Core Variant for Cost-Conscious Flagship Smartphones Read More Mobile, Rumor Angel Morales 12/28/24 Mobile, Rumor Angel Morales 12/28/24 Qualcomm's Snapdragon 8 Elite Gen 2 Exclusively Produced on TSMC’s 3nm Process, Samsung Loses the Production Bid Read More
Semiconductor, Hardware Angel Morales 5/12/26 Semiconductor, Hardware Angel Morales 5/12/26 Intel Reportedly Brings On Package Memory Back With Razor Lake AX to Challenge AMD’s Future Halo Class APUs Read More
Mobile, Semiconductor, Hardware Angel Morales 4/8/26 Mobile, Semiconductor, Hardware Angel Morales 4/8/26 MediaTek Dimensity 9600 Pro Rumored To Push Smartphone Performance Toward Desktop Territory Read More
Hardware Angel Morales 4/7/26 Hardware Angel Morales 4/7/26 Intel Quietly Adds Core Ultra 7 251HX to Arrow Lake HX Lineup With 18 Cores, 5.1 GHz Boost, and 3 Xe Cores Read More
Mobile Angel Morales 1/20/25 Mobile Angel Morales 1/20/25 Snapdragon 8 Elite Gains a 7-Core Variant for Cost-Conscious Flagship Smartphones Read More
Mobile, Rumor Angel Morales 12/28/24 Mobile, Rumor Angel Morales 12/28/24 Qualcomm's Snapdragon 8 Elite Gen 2 Exclusively Produced on TSMC’s 3nm Process, Samsung Loses the Production Bid Read More
