TSMC Sets 2028 for 1.4nm Chip Production With New A14 Node, Strengthening Its Lead in Advanced Semiconductor Technology
The 2nm race is currently dominated by TSMC, which recently began accepting orders for its most advanced process node yet, with Apple expected to be the primary beneficiary. Now, in a forward-looking move announced at the TSMC North America Technology Symposium in Santa Clara, the Taiwanese foundry has revealed that it aims to commence mass production of 1.4nm chips in 2028, introducing a new process node dubbed A14, also referred to as the 14-Angstrom node.
The A14 node represents TSMC’s foray into sub-2nm technology, designed to serve an evolving client base increasingly dependent on cutting-edge power and performance improvements. TSMC CEO C.C. Wei emphasized the company's dedication to meeting its customers’ forward-looking expectations, reinforcing its roadmap for continued innovation and market leadership in advanced semiconductor fabrication.
According to Nikkei Asia, the A14 process node is projected to deliver up to 15% improved performance and a 30% reduction in power consumption compared to current nodes—benchmarks that will be especially critical for next-generation AI, mobile, and HPC (high-performance computing) applications. These gains align with industry expectations for each new node generation and are crucial for both performance scaling and energy efficiency.
Though TSMC has not disclosed which client has first dibs on its 1.4nm technology, Apple is widely assumed to be the leading candidate, given its long-standing, high-volume wafer procurement agreements with the foundry. Apple was previously the first to adopt 5nm and 3nm TSMC chips for its A-series and M-series processors, and that trend is likely to continue with the A14 node.
Meanwhile, TSMC’s primary rival Samsung appears to be taking a different path. While Samsung was once pursuing its own version of a 1.4nm process, it has reportedly cancelled that particular effort for undisclosed reasons. However, in a show of long-term ambition, Samsung has since established a dedicated team targeting 1nm chip production by 2029, signaling its intention to remain a formidable competitor in ultra-advanced process technology, even as TSMC cements its near-term lead.
In parallel with its process advancements, TSMC also revealed that it plans to launch next-generation chip packaging technology by 2027, which will enable the integration of multiple heterogeneous dies—each handling different computing tasks—into a single, tightly connected package. This heterogeneous integration will be vital for improving chip performance and efficiency without relying solely on continued node shrinkage.
TSMC is pushing boundaries yet again with its 1.4nm A14 node. Do you think Apple will be the first to debut devices using this process? What kind of performance leap would you like to see in next-gen chips? Share your thoughts below!
