TSMC Plans to Ramp Up the Competition With Angstrom-Era, Along With Scaling Manufacturing in the US
TSMC continues to lead the semiconductor race with a production cadence unmatched by any other chipmaker. Despite ongoing geopolitical concerns, the company’s growth remains strong. According to a report from Commercial Times (Ctee), TSMC is accelerating its roadmap once again, with one of its largest fabrication sites, Fab 22, now being prepared for A14 (1.4nm) production. At the same time, its plans for US-based manufacturing are progressing much faster than anticipated, with 2nm production in Arizona now expected to begin next year, nearly a full year ahead of schedule.
In southern Taiwan, TSMC’s Kaohsiung facility is shaping up to be one of the company’s most ambitious and expensive projects to date, with an investment exceeding NT$1.5 trillion (US$50 billion). The site will host six fabrication plants, five of which are focused on 2nm and A16 (1.6nm) mass production, while the sixth fab is set to handle A14 (1.4nm) production, expected to enter high-volume manufacturing (HVM) by 2028.
With the inclusion of A16 and A14 nodes, TSMC’s Kaohsiung complex is expected to lead the Angstrom era of semiconductor manufacturing, marking a significant step beyond the nanometer scale and positioning Taiwan as the global hub for next-generation process technologies.
TSMC’s Arizona operations are also moving rapidly. The company plans to introduce 2nm (N2) and A16 nodes through Fabs 3 and 4, with N2 mass production now expected to start in H2 2026. However, the expansion still faces several construction-related hurdles, including plumbing and electrical system installations that need further work.
Even with these challenges, the pace of progress is remarkable. The U.S. government’s active involvement has been key in pushing TSMC to balance its commitments between Taiwan and the U.S. As a result, the Arizona fabs are progressing at a speed few expected, showcasing TSMC’s determination to solidify its global presence and strategic diversification.
The international semiconductor competition remains fierce. Rapidus, Japan’s national chipmaking venture, aims to begin 2nm mass production by 2027, entering direct competition with TSMC and Samsung. Meanwhile, Intel Foundry Services (IFS) plans to reach high-volume manufacturing for its 14A node (1.4nm) by 2028, aligning closely with TSMC’s A14 timeline.
If these schedules hold, Intel and TSMC could be at parity in terms of node size by 2028. However, TSMC’s early start, greater foundry ecosystem, and proven production track record may give it the upper hand in efficiency and reliability.
With Taiwan’s Kaohsiung megafab preparing for Angstrom-level nodes and the U.S. fabs advancing faster than anticipated, TSMC remains firmly positioned to define the next era of semiconductor innovation.
What are your thoughts on TSMC’s Angstrom-era roadmap? Will its aggressive expansion keep it ahead of Intel, Samsung, and Rapidus in the next generation of chip manufacturing?
