Solidigm Intros D7-PS1010 E1.S External SSD with Direct-to-Chip Liquid Cooling
Enterprise data storage manufacturer Solidigm has introduced its latest E1.S form factor SSD, the D7-PS1010, which takes a bold step away from traditional server cooling. Instead of relying on fans, the D7-PS1010 leverages a direct-to-chip liquid cooling system with a cold plate to deliver superior thermals, targeting enterprise workloads where airflow cooling isn’t always practical.
According to Solidigm’s official announcement, the D7-PS1010 is the world’s first single-sided cold-plate solution that effectively cools both sides of the SSD. This approach significantly enhances thermal efficiency, enabling denser and more power-efficient deployments in GPU- and AI-intensive server environments.
“Solidigm’s Cold-Plate-Cooled eSSD is a breakthrough for thermal optimization, unlocking tremendous value inside the most advanced GPU servers. This is the world's first single-sided Cold-Plate solution that cools both sides of the SSD, delivering the most efficient storage subsystem available to alleviate the strain placed on SSDs in dense AI environments.”
- Greg Matson, Senior Vice President and Head of Products and Marketing, Solidigm
The cold-plate design allows coolant to flow across the surface directly in contact with the SSD chips, eliminating the need for additional fans. For hyperscale data centers and enterprise deployments, this solution not only reduces space requirements but also lowers power consumption by removing fan-related overhead. The result is improved efficiency and more room per rack for GPUs or SSDs - two essential elements in today’s AI-driven infrastructure.
The D7-PS1010 will be offered in multiple E1.S thickness options (9.5mm and 15mm) and capacities of 3.84 TB and 7.68 TB. Built on a PCIe Gen 5 interface, Solidigm claims the SSD delivers “best-in-class four-corners storage performance” compared to other Gen 5 E1.S drives.
Solidigm is already working closely with server ODMs and OEMs to qualify the new SSD for recommended vendor lists. Industry leaders like Supermicro have voiced strong support for the new technology.
“Supermicro is excited to collaborate with Solidigm on their E1.S form factor Cold-Plate-Cooled eSSD technology. Their innovative SSDs can be utilized on some of the most advanced liquid-cooled architectures, including the Supermicro NVIDIA HGX B300-based GPU servers supporting compute-intensive workloads.”
- Vik Malyala, MD Europe, Senior Vice President, Technology and AI, Supermicro
By embracing liquid cooling at the storage subsystem level, Solidigm is directly addressing the growing thermal and density challenges in AI and HPC environments. This move marks a significant step forward in data center design, signaling that future enterprise SSDs may increasingly adopt similar fanless solutions.
