Samsung Installed First High-NA EUV Machine for 1.4nm Production in March, Could Benefit from Zero Tariffs to Compete with TSMC

Samsung has officially taken a significant step toward its next-generation semiconductor roadmap, having installed its first ASML High-NA EUV lithography machine in March for 1.4nm wafer production at its Hwaseong plant. The installation, reported by Economic News Daily, marks a crucial milestone in the Korean giant’s attempt to close the technology gap with TSMC.

The adoption of High-NA EUV (Extreme Ultraviolet Lithography) is essential for fabricating chips at and below the 2nm node, allowing transistor features to be printed more accurately and at higher density. However, each ASML EXE:5000 machine costs around $400 million, making the investment a heavy burden even for a company of Samsung’s size. To alleviate this, the South Korean government is reportedly planning to eliminate tariffs on imported semiconductor equipment, effectively reducing costs and bolstering Samsung’s competitiveness in the global chipmaking race.

While earlier reports suggested Samsung had canceled its 1.4nm development, recent progress indicates the company has resolved key yield issues at 2nm GAA (Gate-All-Around). The Exynos 2600, built on the 2nm node, is expected to enter mass production later this year, with Samsung aiming to prove performance parity with TSMC’s 2nm process and scale volumes for broader customer adoption. Once this milestone is achieved, Samsung will shift its focus toward 1.4nm mass production in 2027, hoping to gain a technological lead over TSMC.

To support this roadmap, Samsung has reportedly placed additional orders for ASML High-NA EUV machines to accelerate its 2nm ramp-up. The zero-tariff initiative by the South Korean government is expected to make these investments more sustainable, especially as Samsung pushes to expand its foundry business and secure contracts from major clients currently reliant on TSMC.

If Samsung manages to stabilize yields and maintain its aggressive roadmap, the installation of the High-NA EUV system could represent the beginning of a new phase in the sub-2nm battle with TSMC. With the company targeting 2nm production readiness in 2025 and 1.4nm mass production by 2027, the global semiconductor race is set to intensify.

Do you think Samsung can leverage High-NA EUV adoption and government support to finally challenge TSMC’s dominance at the cutting edge of semiconductor manufacturing?