GIGABYTE Unveils AI-Powered X870E AORUS X3D Motherboards, Redefining Performance and Innovation
GIGABYTE Technology, one of the world’s leading manufacturers of motherboards, graphics cards, and PC hardware solutions, has officially launched its X870E AORUS X3D series motherboards. Engineered for enthusiasts, gamers, and professionals, these premium AMD Socket AM5 motherboards combine cutting-edge AI-driven performance, groundbreaking thermal solutions, and user-first innovations to deliver what GIGABYTE calls the pinnacle of modern PC building technology.
AI-Powered Performance Breakthroughs
At the heart of the X870E AORUS X3D lineup lies X3D Turbo Mode 2.0, an AI-powered optimization engine that adapts dynamically to workloads. Built on a proprietary AI model, this system can boost gaming performance by up to 25%, fine-tuning power and system parameters in real time for both gaming and productivity scenarios.
Paired with this is D5 Bionic Corsa Technology, a new AI-enhanced platform spanning hardware, software, and firmware. This breakthrough pushes DDR5 memory speeds to an unprecedented 9000 MT/s, ensuring record-breaking performance with stability maintained through intelligent real-time analysis and parameter adjustments.
Full new line up of X3D Motherboards:
X870E AORUS MASTER X3D ICE
X870E AORUS PRO X3D ICE
X870E AORUS ELITE X3D ICE
X870E AORUS ELITE X3D
These advancements are supported by PCB Back Drilling Technology on an 8-layer server-grade PCB, designed to minimize signal reflections and interference. Combined with GIGABYTE’s 18+2+2 phase digital twin VRM solution, the boards deliver stable, clean power to unlock the full potential of AMD Ryzen 9000, 8000, and 7000 Series CPUs.
Comprehensive Thermal Management
The X870E AORUS X3D motherboards employ an advanced thermal design to maintain consistent performance under heavy loads:
VRM Thermal Armor Advanced with direct-touch heatpipe design for efficient power delivery cooling.
PCB Thermal Plate, delivering up to 14% improved thermal performance while reinforcing stability.
M.2 EZ-Flex cooling, a patented flexible baseplate tailored for high-efficiency SSD heat dissipation across multiple configurations.
User-Friendly Installation and Design
GIGABYTE continues its tradition of simplifying PC building with a range of thoughtful features:
DriverBIOS with pre-installed Wi-Fi drivers for instant connectivity on first boot.
PCIe EZ-Latch Plus Duo, a tool-less quick-release system for dual PCIe slots.
Rear EZ-Button relocating Power, Reset, Clear CMOS, and Q-Flash+ to the rear panel for accessibility.
WIFI EZ-Plug ensuring secure antenna connections in seconds.
UC BIOS 2.0: Smarter BIOS Interaction
The new UC BIOS 2.0 reimagines BIOS usability with:
One-click screenshot support.
Quick navigation to the BIOS main page.
Instant search to locate settings without scrolling.
Smart 80 Port Diagnostics, blending POST codes with real-time thermal monitoring.
Next-Gen Connectivity
The X870E AORUS X3D offers a forward-looking suite of connectivity options:
Front USB Quick Charge with up to 65W power delivery (trackable in HWinfo).
Dual USB4 Type-C ports with DisplayPort Alt Mode.
HDMI output for integrated graphics.
10GbE LAN + 5GbE LAN networking, paired with Wi-Fi 7 and an ultra-high gain directional antenna for elite wired and wireless performance.
Availability
The X870E AORUS X3D series motherboards are now available worldwide, providing a platform that unites raw performance, AI optimization, and usability innovations.
