Intel Panther Lake Core Ultra Series 3 Lands in Palm Sized Embedded Modules With LPDDR5X and LPCAMM2 Support

Intel is pushing Panther Lake beyond standard laptops and desktops, and the latest move is all about shrinking high performance compute into integrator friendly building blocks for Edge AI and embedded deployments. Following the Intel Tech Tour 2025 showcase, the first commercial wave of Panther Lake module platforms is now being announced, with Congatec revealing new COM HPC and COM Express modules powered by Intel Core Ultra Series 3 Panther Lake processors.

The key headline for system designers is that these modules bring Panther Lake H class CPUs into compact form factors that can slot into industrial PCs, robotics controllers, vision systems, smart kiosks, factory automation nodes, and other edge compute footprints where board space, thermals, and lifecycle planning are non negotiable. Congatec says the lineup supports Panther Lake H CPUs with up to 16 cores, scaling up to the X9 388H, with a baseline 25W TDP target. Power is also positioned as configurable across a broader envelope, with modules able to be tuned between 15W and 65W depending on cooling headroom and workload requirements.

Where this reveal gets especially interesting is memory flexibility, because it shows how Panther Lake can serve both sealed appliance style designs and serviceable field systems depending on the module choice.

For onboard LPDDR5X, Congatec lists 2 core configurations:

The conga MC1000 supports up to 32 GB of onboard LPDDR5X at up to 8533 MT/s.

The larger conga HPC module supports up to 96 GB of onboard LPDDR5X within the same 8533 MT/s ceiling.

For LPCAMM2, Congatec also lists 2 options, scaling up to 96 GB of LPDDR5X operating across roughly 7466 MT/s to 8533 MT/s. This matters because LPCAMM2 is increasingly attractive in embedded designs that want LPDDR class power and bandwidth characteristics while preserving a more modular service model than permanently soldered memory.

For DDR5 SO DIMM, there is also a configuration that supports 2 slots for up to 128 GB of DDR5 memory at up to 7200 MT/s, giving integrators a straightforward upgrade path and easier region specific sourcing.

Congatec positions these Panther Lake modules as Edge AI ready platforms, citing up to 12 Xe3 cores and up to 120 TOPS of AI compute, including a 50 TOPS NPU. The display stack is also framed as robust for high resolution multi display signage and control rooms, with support to run 3 to 4 6K displays independently. For industrial environments, the stated operating range is designed to handle harsh deployments, with operation from minus 40C to 85C. Congatec also states a 10 plus year long term availability cycle, which is a major requirement for industrial buyers that cannot refresh hardware every consumer generation.

Congatec highlights multiple module footprints, giving OEMs a clear scaling ladder from very small builds to higher IO and expansion density.

COM Express Type 10 module (84 mm x 55 mm)

COM HPC mini module (95 mm x 70 mm)

COM Express compact module (95 mm x 95 mm)

COM HPC Client Size A module (95 mm x 120 mm)

From a market angle, this is a clean signal that Intel wants Panther Lake to be a serious edge compute foundation, not only a client CPU. The mix of onboard LPDDR5X, LPCAMM2, and DDR5 SO DIMM options gives embedded customers real levers to balance bandwidth, serviceability, BOM stability, and thermal design. If you are building an AI enabled device that needs long lifecycle support, predictable supply, and scalable performance per watt, these kinds of modules are exactly the format that keeps engineering teams moving fast without reinventing the board every time.

If you were speccing an edge AI box today, would you prioritize onboard LPDDR5X for efficiency, LPCAMM2 for modular serviceability, or DDR5 SO DIMM for maximum capacity and sourcing flexibility?