New SK Hynix 7200 MT/s DDR5 Memory Spotted Featuring 2 Gb B-Die and 4 Gb M-Die Configurations
Memory manufacturer SK Hynix appears to be readying a new wave of DDR5 DRAM chips capable of 7200 MT/s, surpassing the current JEDEC standard of 6400 MT/s. According to a recent leak by @unikoshardware, listings on the major Chinese e-commerce site JD.com revealed several unreleased SK Hynix DDR5 modules using new part numbers that are not yet available on the market.
These listings confirm that SK Hynix has prepared a total of four DDR5 die variants rated for 7200 MT/s, each identified by the “KB” speed designation. The lineup includes C-die, A-die, M-die, and the debut of a B-die, with densities ranging from 2 Gb to 4 Gb.
| Part Number | Die | Speed | Density |
|---|---|---|---|
| H5CG48CKBD-X030 | C-die | 7200 MT/s | 2 Gb |
| H5CGD8AKBD-X021 | A-die | 7200 MT/s | 3 Gb |
| H5CG58MKBD-X051 | M-die | 7200 MT/s | 4 Gb |
| H5CC48BKBD-X030 | B-die | 7200 MT/s | 2 Gb |
The most notable development is the introduction of a 2 Gb B-die, marking the first time this process variant has appeared in SK Hynix’s DDR5 lineup. Additionally, the M-die now debuts in a 4 Gb density, another first for this specific process node. While these capacities are relatively modest compared to the 16 Gb or 24 Gb dies used in higher-capacity DDR5 kits, they are likely optimized for high-speed, low-capacity memory configurations where performance and signal integrity take priority over density.
Images from JD listings show a variety of SK Hynix DDR5 modules labeled as CSODIMM, SODIMM, and ECB RDIMM, each prominently displaying their 7200 MHz frequency markings.
Examples include:
SK Hynix DDR5 CSODIMM 24GB 1Rx8 PC5-7200B-VA0-1312-XT
SK Hynix DDR5 SODIMM 32GB featuring Intel Core and AMD Ryzen compatibility logos
SK Hynix DDR5 ECB RDIMM 32GB memory module labeled with full specifications
SK Hynix DDR5 CSODIMM 16GB with model number HMCG78CKBVA312N AA
Although SK Hynix has yet to officially announce these new 7200 MT/s DRAM dies, it’s evident that engineering samples or early production batches are already circulating within retail channels.
High-speed DDR5 modules such as these require advanced PCB designs, typically 10-layer or 12-layer PCBs, to maintain optimal signal integrity and support overclocking stability at such frequencies. As these new dies transition from internal testing to mass production, it is expected that finalized modules will feature enhanced PCB layouts to ensure consistent performance.
This silent expansion of SK Hynix’s DDR5 portfolio reinforces its leadership in high-performance DRAM manufacturing, aligning with the company’s roadmap to support next-generation platforms like Intel Arrow Lake Refresh and AMD Ryzen 9000 series.
Are you excited to see what memory manufacturers will achieve with SK Hynix’s new 7200 MT/s chips? The next wave of ultra-high-speed DDR5 might be closer than expected.
